Akihito Hatakeyama

Person

Suita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 6,326,694
- Issue date Dec 4, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 6,211,487
- Issue date Apr 3, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting member of a circuit substrate and method of manufacturin...
- Patent number 6,108,903
- Issue date Aug 29, 2000
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 5,972,482
- Issue date Oct 26, 1999
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing two-sided and multi-layered printed circuit...
- Patent number 5,588,207
- Issue date Dec 31, 1996
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting member of a circuit substrate and method of manufacturin...
- Patent number 5,484,647
- Issue date Jan 16, 1996
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing organic substrate used for printed circuits
- Patent number 5,481,795
- Issue date Jan 9, 1996
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-sided printed circuit board a multi-layered printed circuit board
- Patent number 5,440,075
- Issue date Aug 8, 1995
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous substrate and conductive ink filled vias for printed circuits
- Patent number 5,346,750
- Issue date Sep 13, 1994
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Connecting member of a circuit substrate and method of manufacturin...
- Publication number 20010003610
- Publication date Jun 14, 2001
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20010002294
- Publication date May 31, 2001
- Akihito Hatakeyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Akihito Hatakeyama

Person

Patents Grantslast 30 patents

Printed circuit board

Printed circuit board and method of manufacturing the same

Connecting member of a circuit substrate and method of manufacturin...

Printed circuit board and method of manufacturing the same

Method of manufacturing two-sided and multi-layered printed circuit...

Connecting member of a circuit substrate and method of manufacturin...

Method of manufacturing organic substrate used for printed circuits

Two-sided printed circuit board a multi-layered printed circuit board

Porous substrate and conductive ink filled vias for printed circuits

Patents Applicationslast 30 patents

Connecting member of a circuit substrate and method of manufacturin...

Printed circuit board and method of manufacturing the same