Akihito Kawai

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing layered device chip assembly
- Patent number 12,322,655
- Issue date Jun 3, 2025
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,300,545
- Issue date May 13, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,854,891
- Issue date Dec 26, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,115
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,114
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,756,831
- Issue date Sep 12, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and multilayer device chip manufacturing...
- Patent number 11,164,802
- Issue date Nov 2, 2021
- Disco Corporation
- Akihito Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device transferring method
- Patent number 10,658,220
- Issue date May 19, 2020
- Disco Corporation
- Tasuku Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked wafer manufacturing method
- Patent number 8,389,386
- Issue date Mar 5, 2013
- Disco Corporation
- Akihito Kawai
- B24 - GRINDING POLISHING
Information Patent Grant
Lamination device manufacturing method
- Patent number 7,687,375
- Issue date Mar 30, 2010
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposure method
- Patent number 7,601,485
- Issue date Oct 13, 2009
- Disco Corporation
- Kazuma Sekiya
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of dividing a semiconductor wafer
- Patent number 7,129,150
- Issue date Oct 31, 2006
- Disco Corporation
- Akihito Kawai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING LAMINATED ASSEMBLY
- Publication number 20240387229
- Publication date Nov 21, 2024
- Disco Corporation
- Fumihiro INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAYERED DEVICE CHIP ASSEMBLY
- Publication number 20230096486
- Publication date Mar 30, 2023
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED DEVICE WAFER FORMING METHOD
- Publication number 20230020620
- Publication date Jan 19, 2023
- Disco Corporation
- Zhiwen CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157660
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157668
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157669
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157658
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157659
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157667
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND MULTILAYER DEVICE CHIP MANUFACTURING...
- Publication number 20200381315
- Publication date Dec 3, 2020
- Disco Corporation
- Akihito KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE TRANSFERRING METHOD
- Publication number 20190273009
- Publication date Sep 5, 2019
- Disco Corporation
- Tasuku KOYANAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SMALL-DIAMETER WAFER
- Publication number 20190148132
- Publication date May 16, 2019
- Disco Corporation
- Hideji HORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER MANUFACTURING METHOD
- Publication number 20110256667
- Publication date Oct 20, 2011
- Disco Corporation
- Akihito Kawai
- B24 - GRINDING POLISHING
Information Patent Application
STACKED WAFER MANUFACTURING METHOD
- Publication number 20110256665
- Publication date Oct 20, 2011
- Disco Corporation
- Akihito Kawai
- B24 - GRINDING POLISHING
Information Patent Application
LAMINATION DEVICE MANUFACTURING METHOD
- Publication number 20090181519
- Publication date Jul 16, 2009
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via hole forming method
- Publication number 20080076256
- Publication date Mar 27, 2008
- DISCO CORPORATION
- Akihito Kawai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Exposure method
- Publication number 20060199114
- Publication date Sep 7, 2006
- DISCO CORPORATION
- Kazuma Sekiya
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of dividing wafer
- Publication number 20060088983
- Publication date Apr 27, 2006
- Shinichi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for dividing semiconductor wafer along streets
- Publication number 20060073705
- Publication date Apr 6, 2006
- DISCO CORPORATION
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip resin encapsulation method
- Publication number 20060012056
- Publication date Jan 19, 2006
- DISCO CORPORATION
- Shinji Ueno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of dividing a semiconductor wafer
- Publication number 20040180473
- Publication date Sep 16, 2004
- Akihito Kawai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Akihito Kawai

Person

Patents Grantslast 30 patents

Method of manufacturing layered device chip assembly

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and multilayer device chip manufacturing...

Device transferring method

Stacked wafer manufacturing method

Lamination device manufacturing method

Exposure method

Method of dividing a semiconductor wafer

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING LAMINATED ASSEMBLY

METHOD OF MANUFACTURING LAYERED DEVICE CHIP ASSEMBLY

LAMINATED DEVICE WAFER FORMING METHOD

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND MULTILAYER DEVICE CHIP MANUFACTURING...

DEVICE TRANSFERRING METHOD

METHOD OF MANUFACTURING SMALL-DIAMETER WAFER

STACKED WAFER MANUFACTURING METHOD

STACKED WAFER MANUFACTURING METHOD

LAMINATION DEVICE MANUFACTURING METHOD

Via hole forming method

Exposure method

Method of dividing wafer

Method for dividing semiconductor wafer along streets

Semiconductor chip resin encapsulation method

Method of dividing a semiconductor wafer