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Akihito Nishibayashi

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  • Iruma-shi, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230142531
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230146315
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20220152749
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE
    • Publication number 20220157766
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20120104613
    • Publication date May 3, 2012
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
    • Publication number 20100327450
    • Publication date Dec 30, 2010
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
    • Publication number 20100213619
    • Publication date Aug 26, 2010
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS