Membership
Tour
Register
Log in
Akihito Takano
Follow
Person
Nagano-shi, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
Patent number
8,810,007
Issue date
Aug 19, 2014
Shinko Electric Industries Co., Ltd.
Akihito Takano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring substrate, method for manufacturing wiring substrate, and se...
Patent number
8,766,101
Issue date
Jul 1, 2014
Shinko Electric Industries Co., Ltd.
Ken Miyairi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
Patent number
8,669,643
Issue date
Mar 11, 2014
Shinko Electric Industries Co., Ltd.
Akihito Takano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring substrate and method for manufacturing the wiring substrate
Patent number
8,446,013
Issue date
May 21, 2013
Shinko Electric Industries Co., Ltd.
Masahiro Sunohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor device and method of manufacturing the same
Patent number
8,101,461
Issue date
Jan 24, 2012
Shinko Electric Industries Co., Ltd.
Akihito Takano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminated body of semiconductor chips including pads mutually conne...
Patent number
8,058,717
Issue date
Nov 15, 2011
Shinko Electric Industries Co., Ltd.
Akihito Takano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitor device and semiconductor device having the same, and capa...
Patent number
7,358,591
Issue date
Apr 15, 2008
Shinko Electric Industries Co., Ltd.
Yasuyoshi Horikawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing an electronic parts packaging structure
Patent number
7,319,049
Issue date
Jan 15, 2008
Shinko Electric Industries Co., Ltd.
Kiyoshi Oi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device, semiconductor device substrate, and manufactu...
Patent number
7,161,242
Issue date
Jan 9, 2007
Shinko Electric Industries Co., Ltd.
Tomoo Yamasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer circuit board and semiconductor device using the same
Patent number
6,891,732
Issue date
May 10, 2005
Shinko Electric Industries Co., Ltd.
Akihito Takano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for manufacturing multiple layer wiring substrate onto whic...
Patent number
6,754,952
Issue date
Jun 29, 2004
Shinko Electric Industries Co., Ltd.
Akihito Takano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thin film capacitance device and printed circuit board
Patent number
6,498,714
Issue date
Dec 24, 2002
Shinko Electric Industries Co., Ltd.
Akira Fujisawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20140151891
Publication date
Jun 5, 2014
Shinko Electric Industries Co., Ltd.
Akihito TAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...
Publication number
20130056251
Publication date
Mar 7, 2013
Shinko Electric Industries Co., Ltd.
Ken Miyairi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wiring Board, Semiconductor Device, and Method for Manufacturing Wi...
Publication number
20120261801
Publication date
Oct 18, 2012
Taiyo Yuden Co., Ltd.
Akihito TAKANO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Wiring Board, Semiconductor Device, and Method for Manufacturing Wi...
Publication number
20120261832
Publication date
Oct 18, 2012
Taiyo Yuden Co., Ltd.
Akihito TAKANO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE
Publication number
20110316169
Publication date
Dec 29, 2011
Shinko Electric Industries Co., Ltd.
Masahiro SUNOHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP LAMINATED BODY
Publication number
20100320584
Publication date
Dec 23, 2010
Shinko Electric Industries Co., Ltd.
Akihito TAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20100148340
Publication date
Jun 17, 2010
Shinko Electric Industries Co., Ltd.
Akihito TAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic part-containing elements, electronic devices and product...
Publication number
20060017133
Publication date
Jan 26, 2006
Shinko Electric Industries Co., Ltd.
Kiyoshi Oi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of manufacturing an electronic parts packaging structure
Publication number
20050247665
Publication date
Nov 10, 2005
Shinko Electric Industries Co., Ltd.
Kiyoshi Oi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Capacitor device and semiconductor device having the same, and capa...
Publication number
20050199929
Publication date
Sep 15, 2005
Shinko Electric Industries Co., Ltd.
Yasuyoshi Horikawa
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor device, semiconductor device substrate, and manufactu...
Publication number
20040183187
Publication date
Sep 23, 2004
Tomoo Yamasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method for manufacturing same
Publication number
20030094686
Publication date
May 22, 2003
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process for manufacturing multiple layer wiring substrate onto whic...
Publication number
20030088978
Publication date
May 15, 2003
Shinko Electric Industries Co., Ltd.
Akihito Takano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer circuit board and semiconductor device using the same
Publication number
20030058630
Publication date
Mar 27, 2003
Akihito Takano
H01 - BASIC ELECTRIC ELEMENTS