Akiko Fujii

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die pick-up apparatus and method of picking up semico...
- Patent number 9,028,649
- Issue date May 12, 2015
- Shinkawa Ltd.
- Motoki Nakazawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper interconnection
- Patent number 6,670,639
- Issue date Dec 30, 2003
- NEC Corporation
- Hidekazu Okabayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...
- Publication number 20130272837
- Publication date Oct 17, 2013
- Motoki Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS