Akiko Kigawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Processing apparatus configured for processing wafers continuously...
- Patent number 11,810,807
- Issue date Nov 7, 2023
- Disco Corporation
- Akiko Kigawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanding method
- Patent number 11,145,533
- Issue date Oct 12, 2021
- Disco Corporation
- Akiko Kigawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing method
- Patent number 10,475,676
- Issue date Nov 12, 2019
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING APPARATUS
- Publication number 20220068685
- Publication date Mar 3, 2022
- Disco Corporation
- Akiko KIGAWA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
EXPANDING METHOD AND EXPANDING APPARATUS
- Publication number 20190109035
- Publication date Apr 11, 2019
- Disco Corporation
- Akiko KIGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20180342408
- Publication date Nov 29, 2018
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS