Akimasa YUASA

Person

Omuta-shi, Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ceramic-copper composite, method of producing ceramic-copper compos...
- Patent number 12,065,385
- Issue date Aug 20, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic circuit board and production method therefor
- Patent number 11,483,926
- Issue date Oct 25, 2022
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board, method for manufacturing ceramic circuit boa...
- Patent number 11,452,204
- Issue date Sep 20, 2022
- DENKA COMPANY LIMITED
- Yusaku Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board and method for producing same
- Patent number 11,277,908
- Issue date Mar 15, 2022
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum-silicon-carbide composite and method of manufacturing same
- Patent number 10,919,811
- Issue date Feb 16, 2021
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ceramic circuit substrate and method for manufacturing same
- Patent number 10,796,925
- Issue date Oct 6, 2020
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board and method for producing same
- Patent number 9,872,380
- Issue date Jan 16, 2018
- DENKA COMPANY LIMITED
- Ryota Aono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND...
- Publication number 20220225498
- Publication date Jul 14, 2022
- DENKA COMPANY LIMITED
- Akimasa YUASA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING NITRIDE CERAMIC SUBSTRATE AND NITRIDE CERAM...
- Publication number 20220161366
- Publication date May 26, 2022
- DENKA COMPANY LIMITED
- Akimasa YUASA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC GREEN SHEET, CERAMIC SUBSTRATE, METHOD OF PRODUCING CERAMIC...
- Publication number 20220147723
- Publication date May 12, 2022
- DENKA COMPANY LIMITED
- Akimasa YUASA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING SINGLE SHEET-TYPE GREEN SHEET, METHOD FOR...
- Publication number 20220098121
- Publication date Mar 31, 2022
- DENKA COMPANY LIMITED
- Akimasa YUASA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC-COPPER COMPOSITE, METHOD OF PRODUCING CERAMIC-COPPER COMPOS...
- Publication number 20220009842
- Publication date Jan 13, 2022
- DENKA COMPANY LIMITED
- Akimasa YUASA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
- Publication number 20210176859
- Publication date Jun 10, 2021
- DENKA COMPANY LIMITED
- Akimasa YUASA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
- Publication number 20200163210
- Publication date May 21, 2020
- DENKA COMPANY LIMITED
- Akimasa YUASA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOA...
- Publication number 20200128664
- Publication date Apr 23, 2020
- DENKA COMPANY LIMITED
- Yusaku HARADA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190115228
- Publication date Apr 18, 2019
- Denka Company Limited
- Akimasa YUASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM-SILICON-CARBIDE COMPOSITE AND METHOD OF MANUFACTURING SAME
- Publication number 20180215668
- Publication date Aug 2, 2018
- Denka Company Limited
- Akimasa YUASA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
- Publication number 20170181272
- Publication date Jun 22, 2017
- Denka Company Limited
- Ryota AONO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Akimasa YUASA

Person

Patents Grantslast 30 patents

Ceramic-copper composite, ceramic circuit board, power module, and...

Ceramic-copper composite, method of producing ceramic-copper compos...

Ceramic circuit board and production method therefor

Ceramic circuit board, method for manufacturing ceramic circuit boa...

Ceramic circuit board and method for producing same

Aluminum-silicon-carbide composite and method of manufacturing same

Ceramic circuit substrate and method for manufacturing same

Ceramic circuit board and method for producing same

Patents Applicationslast 30 patents

CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND...

METHOD OF MANUFACTURING NITRIDE CERAMIC SUBSTRATE AND NITRIDE CERAM...

CERAMIC GREEN SHEET, CERAMIC SUBSTRATE, METHOD OF PRODUCING CERAMIC...

METHOD FOR MANUFACTURING SINGLE SHEET-TYPE GREEN SHEET, METHOD FOR...

CERAMIC-COPPER COMPOSITE, METHOD OF PRODUCING CERAMIC-COPPER COMPOS...

CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

CERAMIC CIRCUIT BOARD, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOA...

CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME

ALUMINUM-SILICON-CARBIDE COMPOSITE AND METHOD OF MANUFACTURING SAME

CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME