Akimori Hayashi

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 7,728,444
- Issue date Jun 1, 2010
- NEC Electronics Corporation
- Akimori Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate for a semiconductor device having thermoplastic r...
- Patent number 7,378,745
- Issue date May 27, 2008
- NEC Electronics Corporation
- Akimori Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having colored outer layer
- Patent number 7,323,238
- Issue date Jan 29, 2008
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120261840
- Publication date Oct 18, 2012
- RENESAS ELECTORNICS CORPORATION
- Tetsuya Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100007005
- Publication date Jan 14, 2010
- NEC Electronics Corporation
- Tetsuya Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board
- Publication number 20080164622
- Publication date Jul 10, 2008
- NEC Electronics Corporation
- Akimori Hayashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed board and manufacturing method thereof
- Publication number 20060068180
- Publication date Mar 30, 2006
- DENSO CORPORATION
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate for a semiconductor device, a fabrication method...
- Publication number 20060044735
- Publication date Mar 2, 2006
- NEC ELECTRONICS CORPORATION
- Akimori Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR