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Tochigi, JP
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last 30 patents
Information
Patent Grant
Semiconductor device, semiconductor device substrate, and methods o...
Patent number
6,617,193
Issue date
Sep 9, 2003
Hitachi Chemical Company, Ltd.
Yamazaki Toshio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of fabrication thereof
Patent number
6,492,203
Issue date
Dec 10, 2002
Hitachi Chemical Company, Ltd.
Yoshiaki Wakashima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Board for mounting semiconductor element, method for manufacturing...
Patent number
6,268,648
Issue date
Jul 31, 2001
Hitachi Chemical Co., Ltd.
Naoki Fukutomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding film for printed circuit boards
Patent number
5,885,723
Issue date
Mar 23, 1999
Hitachi Chemical Company, Ltd.
Atsushi Takahashi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Metal foil for printed wiring board and production thereof
Patent number
5,689,879
Issue date
Nov 25, 1997
Hitachi Chemical Company, Ltd.
Naoyuki Urasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for producing multilayer printed circuit board
Patent number
5,690,837
Issue date
Nov 25, 1997
Hitachi Chemical Company, Ltd.
Akishi Nakaso
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for producing a printed wiring board
Patent number
5,638,598
Issue date
Jun 17, 1997
Hitachi Chemical Company, Ltd.
Akishi Nakaso
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board and production thereof
Patent number
5,444,189
Issue date
Aug 22, 1995
Hitachi Chemical Co., Ltd.
Akishi Nakaso
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal foil for printed wiring board and production thereof
Patent number
5,403,672
Issue date
Apr 4, 1995
Hitachi Chemical Co., Ltd.
Naoyuki Urasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for producing high-density wiring board
Patent number
4,830,691
Issue date
May 16, 1989
Hitachi Chemical Company, Ltd.
Akinari Kida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR