Akinori Shiraishi

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Probe guide plate and method for manufacturing the same
- Patent number 9,523,716
- Issue date Dec 20, 2016
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Grant
Guide plate for probe card
- Patent number 9,459,287
- Issue date Oct 4, 2016
- JAPAN ELECTRONIC MATERIALS CORPORATION
- Teppei Kimura
- G01 - MEASURING TESTING
Information Patent Grant
Light emitting device that includes wavelength conversion layer hav...
- Patent number 9,099,615
- Issue date Aug 4, 2015
- Koito Manufacturing Co., Ltd.
- Yasuaki Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card and manufacturing method thereof
- Patent number 9,052,341
- Issue date Jun 9, 2015
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Grant
Test-use individual substrate, probe, and semiconductor wafer testi...
- Patent number 8,922,232
- Issue date Dec 30, 2014
- Advantest Corporation
- Shigeru Matsumura
- G01 - MEASURING TESTING
Information Patent Grant
Probe card and method for manufacturing probe card
- Patent number 8,922,234
- Issue date Dec 30, 2014
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device, method of manufacturing the same and w...
- Patent number 8,878,357
- Issue date Nov 4, 2014
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 8,836,119
- Issue date Sep 16, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 8,777,638
- Issue date Jul 15, 2014
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 8,772,822
- Issue date Jul 8, 2014
- Shinko Electric Industries Co., Ltd.
- Rie Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the wiring substrate
- Patent number 8,759,685
- Issue date Jun 24, 2014
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Frame-attached anti-reflection glass and method of manufacturing th...
- Patent number 8,622,556
- Issue date Jan 7, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- G02 - OPTICS
Information Patent Grant
Light emitting device and package component
- Patent number 8,611,389
- Issue date Dec 17, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for electronic component, manufacturing method thereof and...
- Patent number 8,564,077
- Issue date Oct 22, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing optical waveguide, optical waveguide and op...
- Patent number 8,532,457
- Issue date Sep 10, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 8,481,863
- Issue date Jul 9, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip stacked body and method of manufacturing the same
- Patent number 8,394,678
- Issue date Mar 12, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,372,691
- Issue date Feb 12, 2013
- Shinko Electric Industries, Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat radiation package and semiconductor device
- Patent number 8,368,206
- Issue date Feb 5, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 8,350,390
- Issue date Jan 8, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method of the same
- Patent number 8,314,344
- Issue date Nov 20, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 8,304,862
- Issue date Nov 6, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 8,299,370
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,227,909
- Issue date Jul 24, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component device, and method of manufacturing the same
- Patent number 8,178,957
- Issue date May 15, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having an element mounted on a substrate and a...
- Patent number 8,148,738
- Issue date Apr 3, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon substrate for package
- Patent number 8,106,484
- Issue date Jan 31, 2012
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting apparatus
- Patent number 8,100,555
- Issue date Jan 24, 2012
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashii
- F21 - LIGHTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,053,886
- Issue date Nov 8, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 8,044,429
- Issue date Oct 25, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
GUIDE PLATE FOR PROBE CARD
- Publication number 20140266275
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Teppei KIMURA
- G01 - MEASURING TESTING
Information Patent Application
PROBE GUIDE PLATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140266274
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD
- Publication number 20140055157
- Publication date Feb 27, 2014
- Shinko Electric Industries Co., LTD.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140042616
- Publication date Feb 13, 2014
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20130163632
- Publication date Jun 27, 2013
- Shinko Electric Industries Co., Ltd.
- Rie Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Device
- Publication number 20130121009
- Publication date May 16, 2013
- Shinko Electric Industries Co., Ltd.
- Yasuaki Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20130000955
- Publication date Jan 3, 2013
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20120327574
- Publication date Dec 27, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120325529
- Publication date Dec 27, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120229157
- Publication date Sep 13, 2012
- Shinko Electric Industries Co., Ltd.
- Akinori SHIRAISHI
- G01 - MEASURING TESTING
Information Patent Application
FRAME-ATTACHED ANTI-REFLECTION GLASS AND METHOD OF MANUFACTURING TH...
- Publication number 20120154918
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- G02 - OPTICS
Information Patent Application
LIGHT EMITTING DEVICE AND PACKAGE COMPONENT
- Publication number 20120128021
- Publication date May 24, 2012
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND W...
- Publication number 20120086116
- Publication date Apr 12, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEST-USE INDIVIDUAL SUBSTRATE, PROBE, AND SEMICONDUCTOR WAFER TESTI...
- Publication number 20120049876
- Publication date Mar 1, 2012
- Shinko Electric Industries Co., Ltd.
- Shigeru MATSUMURA
- G01 - MEASURING TESTING
Information Patent Application
Wiring Substrate Manufacturing Method and Wiring Substrate
- Publication number 20110272821
- Publication date Nov 10, 2011
- Yuichi TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD
- Publication number 20110260744
- Publication date Oct 27, 2011
- Shinko Electric Industries Co., LTD.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Application
SILICON SUBSTRATE FOR PACKAGE
- Publication number 20110227218
- Publication date Sep 22, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156242
- Publication date Jun 30, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE AND OP...
- Publication number 20110150405
- Publication date Jun 23, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori SHIRAISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20110147951
- Publication date Jun 23, 2011
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110032710
- Publication date Feb 10, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING APPARATUS
- Publication number 20100321936
- Publication date Dec 23, 2010
- SHINKO ELECTRICAL INDUSTRIES CO., LTD.
- Mitsutoshi HIGASHI
- F21 - LIGHTING
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100212950
- Publication date Aug 26, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100207218
- Publication date Aug 19, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING...
- Publication number 20100193939
- Publication date Aug 5, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100190295
- Publication date Jul 29, 2010
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND...
- Publication number 20100155862
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20100155928
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100133677
- Publication date Jun 3, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE
- Publication number 20100108361
- Publication date May 6, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Akinori Shiraishi

Person

Patents Grantslast 30 patents

Probe guide plate and method for manufacturing the same

Guide plate for probe card

Light emitting device that includes wavelength conversion layer hav...

Probe card and manufacturing method thereof

Test-use individual substrate, probe, and semiconductor wafer testi...

Probe card and method for manufacturing probe card

Electronic component device, method of manufacturing the same and w...

Semiconductor device

Wiring board and method of manufacturing the same

Light emitting device

Wiring substrate and method of manufacturing the wiring substrate

Frame-attached anti-reflection glass and method of manufacturing th...

Light emitting device and package component

Package for electronic component, manufacturing method thereof and...

Method of manufacturing optical waveguide, optical waveguide and op...

Substrate and method for manufacturing the same

Semiconductor chip stacked body and method of manufacturing the same

Method of manufacturing semiconductor device

Heat radiation package and semiconductor device

Wiring substrate and semiconductor device

Wiring board and manufacturing method of the same

Semiconductor package and manufacturing method of the same

Wiring board and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Electronic component device, and method of manufacturing the same

Semiconductor device having an element mounted on a substrate and a...

Silicon substrate for package

Lighting apparatus

Semiconductor package and manufacturing method thereof

Light-emitting device and method for manufacturing the same

Patents Applicationslast 30 patents

GUIDE PLATE FOR PROBE CARD

PROBE GUIDE PLATE AND METHOD FOR MANUFACTURING THE SAME

PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD

SEMICONDUCTOR DEVICE

LIGHT EMITTING DEVICE

Light Emitting Device

WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC COMPONENT

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

PROBE CARD AND MANUFACTURING METHOD THEREOF

FRAME-ATTACHED ANTI-REFLECTION GLASS AND METHOD OF MANUFACTURING TH...

LIGHT EMITTING DEVICE AND PACKAGE COMPONENT

ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND W...

TEST-USE INDIVIDUAL SUBSTRATE, PROBE, AND SEMICONDUCTOR WAFER TESTI...

Wiring Substrate Manufacturing Method and Wiring Substrate

PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD

SILICON SUBSTRATE FOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE AND OP...

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHTING APPARATUS

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE