Akio Ashida

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Slurry useful for wire-saw slicing and evaluation of slurry
- Patent number 6,422,067
- Issue date Jul 23, 2002
- Super Silicon Crystal Research Institute Corporation
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Aqueous compositions, aqueous cutting fluid using the same, method...
- Patent number 6,221,814
- Issue date Apr 24, 2001
- Shin-Etsu Handotai Co., Ltd.
- Shingo Kaburagi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Recovery of coolant and abrasive grains used in slicing semiconduct...
- Patent number 6,001,265
- Issue date Dec 14, 1999
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting fluid, method for production thereof, and method for cuttin...
- Patent number 5,693,596
- Issue date Dec 2, 1997
- Shin-Etsu Handotai Co., Ltd.
- Shingo Kaburagi
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...