Akio Hoshi

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of fabricating same, as well as lea...
- Patent number 5,382,546
- Issue date Jan 17, 1995
- Hitachi, Ltd.
- Tomio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having heat dissipation/electrical co...
- Patent number 5,299,091
- Issue date Mar 29, 1994
- Hitachi, Ltd.
- Akio Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device having a particular mountin...
- Patent number 5,150,193
- Issue date Sep 22, 1992
- Hitachi, Ltd.
- Toshihiro Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device using the same
- Patent number 5,041,901
- Issue date Aug 20, 1991
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount plastic package semiconductor integrated circuit, man...
- Patent number 4,920,074
- Issue date Apr 24, 1990
- Hitachi, Ltd.
- Ichio Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Container for electrical components
- Patent number 4,702,371
- Issue date Oct 27, 1987
- Hitachi, Ltd.
- Akio Hoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR