Akio Nishida

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three dimensional memory device and method of making thereof by for...
- Patent number 12,101,936
- Issue date Sep 24, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
Information Patent Grant
Three-dimensional memory device with isolated source strips and met...
- Patent number 12,058,854
- Issue date Aug 6, 2024
- SanDisk Technologies LLC
- Takaaki Iwai
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with separated source-side lines an...
- Patent number 11,889,684
- Issue date Jan 30, 2024
- SanDisk Technologies LLC
- Masanori Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having support-die-assisted source...
- Patent number 11,791,327
- Issue date Oct 17, 2023
- SanDisk Technologies LLC
- Kwang-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded die assembly using a face-to-back oxide bonding and methods...
- Patent number 11,587,943
- Issue date Feb 21, 2023
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with separated source-side lines an...
- Patent number 11,393,836
- Issue date Jul 19, 2022
- SanDisk Technologies LLC
- Masanori Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device with bonded structures including a support...
- Patent number 11,276,708
- Issue date Mar 15, 2022
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,201,107
- Issue date Dec 14, 2021
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,195,781
- Issue date Dec 7, 2021
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having support-die-assisted source...
- Patent number 11,133,297
- Issue date Sep 28, 2021
- SanDisk Technologies LLC
- Kwang-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device with bonded structures including a support...
- Patent number 11,069,703
- Issue date Jul 20, 2021
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure including a performance-optimized support chip and...
- Patent number 11,011,506
- Issue date May 18, 2021
- SanDisk Technologies LLC
- Naohiro Hosoda
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor die stacking using vertical interconnection by throug...
- Patent number 10,957,680
- Issue date Mar 23, 2021
- SanDisk Technologies LLC
- Shinsuke Yada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bifurcated memory die module semiconductor device
- Patent number 10,923,462
- Issue date Feb 16, 2021
- Western Digital Technologies, Inc.
- Toshiki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing a replacement buried sou...
- Patent number 10,923,496
- Issue date Feb 16, 2021
- SanDisk Technologies LLC
- Mitsuteru Mushiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including a semiconductor-on-insulator die and meth...
- Patent number 10,903,164
- Issue date Jan 26, 2021
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a deformation-resistant e...
- Patent number 10,833,100
- Issue date Nov 10, 2020
- SanDisk Technologies LLC
- Kenji Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing memory die bonded to integrated peripher...
- Patent number 10,811,058
- Issue date Oct 20, 2020
- SanDisk Technologies LLC
- Yanli Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonded assembly including a semiconductor-on-insulator die and meth...
- Patent number 10,804,202
- Issue date Oct 13, 2020
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded die assembly using a face-to-back oxide bonding and methods...
- Patent number 10,797,062
- Issue date Oct 6, 2020
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing a replacement buried sou...
- Patent number 10,797,070
- Issue date Oct 6, 2020
- SanDisk Technologies LLC
- Mitsuteru Mushiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having stressed vertical semiconduc...
- Patent number 10,797,060
- Issue date Oct 6, 2020
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having stressed vertical semiconduc...
- Patent number 10,797,061
- Issue date Oct 6, 2020
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing drain-select-level air g...
- Patent number 10,741,576
- Issue date Aug 11, 2020
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device with bonded structures including a support...
- Patent number 10,714,497
- Issue date Jul 14, 2020
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical chip interposer and method of making a chip assembly conta...
- Patent number 10,700,028
- Issue date Jun 30, 2020
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure including a performance-optimized support chip and...
- Patent number 10,665,580
- Issue date May 26, 2020
- SanDisk Technologies LLC
- Naohiro Hosoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a deformation-resistant e...
- Patent number 10,665,607
- Issue date May 26, 2020
- SanDisk Technologies LLC
- Kenji Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing hydrogen diffusion block...
- Patent number 10,515,897
- Issue date Dec 24, 2019
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional NAND memory containing dual protrusion charge tra...
- Patent number 10,516,025
- Issue date Dec 24, 2019
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...
- Publication number 20220352201
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH ISOLATED SOURCE STRIPS AND MET...
- Publication number 20220336484
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE-SIDE LINES AN...
- Publication number 20220157841
- Publication date May 19, 2022
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE-SIDE LINES AN...
- Publication number 20220157842
- Publication date May 19, 2022
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...
- Publication number 20220013518
- Publication date Jan 13, 2022
- SANDISK TECHNOLOGIES LLC
- Kwang-Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DIE ASSEMBLY USING A FACE-TO-BACK OXIDE BONDING AND METHODS...
- Publication number 20200402990
- Publication date Dec 24, 2020
- SANDISK TECHNOLOGIES LLC
- Masatoshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DIE ASSEMBLY USING A FACE-TO-BACK OXIDE BONDING AND METHODS...
- Publication number 20200335512
- Publication date Oct 22, 2020
- SANDISK TECHNOLOGIES LLC
- Masatoshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING A SEMICONDUCTOR-ON-INSULATOR DIE AND METH...
- Publication number 20200294918
- Publication date Sep 17, 2020
- SANDISK TECHNOLOGIES LLC
- Akio NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...
- Publication number 20200295043
- Publication date Sep 17, 2020
- SANDISK TECHNOLOGIES LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...
- Publication number 20200286875
- Publication date Sep 10, 2020
- SANDISK TECHNOLOGIES LLC
- Akio NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING A SEMICONDUCTOR-ON-INSULATOR DIE AND METH...
- Publication number 20200266146
- Publication date Aug 20, 2020
- SANDISK TECHNOLOGIES LLC
- Akio NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE INCLUDING A PERFORMANCE-OPTIMIZED SUPPORT CHIP AND...
- Publication number 20200258876
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Naohiro HOSODA
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20200258817
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20200258816
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING MEMORY DIE BONDED TO INTEGRATED PERIPHER...
- Publication number 20200251149
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Yanli ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A DEFORMATION-RESISTANT E...
- Publication number 20200235123
- Publication date Jul 23, 2020
- SANDISK TECHNOLOGIES LLC
- Kenji SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACKING USING VERTICAL INTERCONNECTION BY THROUG...
- Publication number 20200227397
- Publication date Jul 16, 2020
- SANDISK TECHNOLOGIES LLC
- Shinsuke YADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A REPLACEMENT BURIED SOU...
- Publication number 20200219895
- Publication date Jul 9, 2020
- SANDISK TECHNOLOGIES LLC
- Mitsuteru MUSHIGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A REPLACEMENT BURIED SOU...
- Publication number 20200219896
- Publication date Jul 9, 2020
- SANDISK TECHNOLOGIES LLC
- Mitsuteru MUSHIGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING STRESSED VERTICAL SEMICONDUC...
- Publication number 20200194445
- Publication date Jun 18, 2020
- SanDisk Technologies LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING STRESSED VERTICAL SEMICONDUC...
- Publication number 20200194446
- Publication date Jun 18, 2020
- SanDisk Technologies LLC
- Akio NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...
- Publication number 20200066703
- Publication date Feb 27, 2020
- SANDISK TECHNOLOGIES LLC
- Kwang-Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DRAIN-SELCT-LEVEL AIR GA...
- Publication number 20200058673
- Publication date Feb 20, 2020
- SANDISK TECHNOLOGIES LLC
- Masatoshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY CONTAINING DUAL PROTRUSION CHARGE TRA...
- Publication number 20190386108
- Publication date Dec 19, 2019
- SANDISK TECHNOLOGIES LLC
- Masatoshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HYDROGEN DIFFUSION BLOCK...
- Publication number 20190355663
- Publication date Nov 21, 2019
- SanDisk Technologies LLC
- Masatoshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIFURCATED MEMORY DIE MODULE SEMICONDUCTOR DEVICE
- Publication number 20190341375
- Publication date Nov 7, 2019
- Western Digital Technologies, Inc.
- Toshiki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL CHIP INTERPOSER AND METHOD OF MAKING A CHIP ASSEMBLY CONTA...
- Publication number 20190252361
- Publication date Aug 15, 2019
- SanDisk Technologies LLC
- Akio NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...
- Publication number 20190221557
- Publication date Jul 18, 2019
- SANDISK TECHNOLOGIES LLC
- Kwang-Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THREE-DIMENSIONAL NONVOLATILE MEMORY
- Publication number 20190034125
- Publication date Jan 31, 2019
- SanDisk Technologies LLC
- Jongsun Sel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL RERAM MEMORY DEVICE EMPLOYING REPLACEMENT WORD LI...
- Publication number 20190006418
- Publication date Jan 3, 2019
- SanDisk Technologies LLC
- Jongsun SEL
- H01 - BASIC ELECTRIC ELEMENTS

Akio Nishida

Person

Patents Grantslast 30 patents

Three dimensional memory device and method of making thereof by for...

Three-dimensional memory device with isolated source strips and met...

Three-dimensional memory device with separated source-side lines an...

Three-dimensional memory device having support-die-assisted source...

Bonded die assembly using a face-to-back oxide bonding and methods...

Three-dimensional memory device with separated source-side lines an...

Three-dimensional device with bonded structures including a support...

Bonded three-dimensional memory devices and methods of making the s...

Bonded three-dimensional memory devices and methods of making the s...

Three-dimensional memory device having support-die-assisted source...

Three-dimensional device with bonded structures including a support...

Bonded structure including a performance-optimized support chip and...

Semiconductor die stacking using vertical interconnection by throug...

Bifurcated memory die module semiconductor device

Three-dimensional memory device containing a replacement buried sou...

Bonded assembly including a semiconductor-on-insulator die and meth...

Three-dimensional memory device including a deformation-resistant e...

Bonded assembly containing memory die bonded to integrated peripher...

Bonded assembly including a semiconductor-on-insulator die and meth...

Bonded die assembly using a face-to-back oxide bonding and methods...

Three-dimensional memory device containing a replacement buried sou...

Three-dimensional memory device having stressed vertical semiconduc...

Three-dimensional memory device having stressed vertical semiconduc...

Three-dimensional memory device containing drain-select-level air g...

Three-dimensional device with bonded structures including a support...

Vertical chip interposer and method of making a chip assembly conta...

Bonded structure including a performance-optimized support chip and...

Three-dimensional memory device including a deformation-resistant e...

Three-dimensional memory device containing hydrogen diffusion block...

Three-dimensional NAND memory containing dual protrusion charge tra...

Patents Applicationslast 30 patents

THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...

THREE-DIMENSIONAL MEMORY DEVICE WITH ISOLATED SOURCE STRIPS AND MET...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE-SIDE LINES AN...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE-SIDE LINES AN...

THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...

BONDED DIE ASSEMBLY USING A FACE-TO-BACK OXIDE BONDING AND METHODS...

BONDED DIE ASSEMBLY USING A FACE-TO-BACK OXIDE BONDING AND METHODS...

BONDED ASSEMBLY INCLUDING A SEMICONDUCTOR-ON-INSULATOR DIE AND METH...

THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...

THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...

BONDED ASSEMBLY INCLUDING A SEMICONDUCTOR-ON-INSULATOR DIE AND METH...

BONDED STRUCTURE INCLUDING A PERFORMANCE-OPTIMIZED SUPPORT CHIP AND...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

BONDED ASSEMBLY CONTAINING MEMORY DIE BONDED TO INTEGRATED PERIPHER...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A DEFORMATION-RESISTANT E...

SEMICONDUCTOR DIE STACKING USING VERTICAL INTERCONNECTION BY THROUG...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A REPLACEMENT BURIED SOU...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A REPLACEMENT BURIED SOU...

THREE-DIMENSIONAL MEMORY DEVICE HAVING STRESSED VERTICAL SEMICONDUC...

THREE-DIMENSIONAL MEMORY DEVICE HAVING STRESSED VERTICAL SEMICONDUC...

THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DRAIN-SELCT-LEVEL AIR GA...

THREE-DIMENSIONAL NAND MEMORY CONTAINING DUAL PROTRUSION CHARGE TRA...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HYDROGEN DIFFUSION BLOCK...

BIFURCATED MEMORY DIE MODULE SEMICONDUCTOR DEVICE

VERTICAL CHIP INTERPOSER AND METHOD OF MAKING A CHIP ASSEMBLY CONTA...

THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE...

METHODS AND APPARATUS FOR THREE-DIMENSIONAL NONVOLATILE MEMORY

THREE-DIMENSIONAL RERAM MEMORY DEVICE EMPLOYING REPLACEMENT WORD LI...