AKIO ROKUGAWA

Person

NAGANO-SHI, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 10,978,383
- Issue date Apr 13, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 10,366,949
- Issue date Jul 30, 2019
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 10,028,393
- Issue date Jul 17, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,875,957
- Issue date Jan 23, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,820,391
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,735,098
- Issue date Aug 15, 2017
- Shinko Electric Industries Co., Ltd.
- Hiromu Arisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic component device, and method for manufactu...
- Patent number 9,620,446
- Issue date Apr 11, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 9,565,775
- Issue date Feb 7, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 9,520,352
- Issue date Dec 13, 2016
- Shinko Electric Industries Co., Ltd.
- Hiromu Arisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,455,219
- Issue date Sep 27, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 9,380,707
- Issue date Jun 28, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,257,386
- Issue date Feb 9, 2016
- Shinko Electric Industries Co., Ltd.
- Hiromu Arisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, semiconductor device, and method of manufacturing...
- Patent number 9,220,167
- Issue date Dec 22, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 9,167,692
- Issue date Oct 20, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,148,952
- Issue date Sep 29, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 9,119,319
- Issue date Aug 25, 2015
- Shinko Electric Industries Co., Ltd.
- Wataru Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package, semiconductor device, and method for manufac...
- Patent number 9,054,082
- Issue date Jun 9, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,000,302
- Issue date Apr 7, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including a metal plate, semiconductor chip,...
- Patent number 8,994,193
- Issue date Mar 31, 2015
- Shinko Electric Industries Co., Ltd.
- Akihiko Tateiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package, semiconductor package manufacturing method a...
- Patent number 8,823,187
- Issue date Sep 2, 2014
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and its manufacture method
- Patent number 8,791,561
- Issue date Jul 29, 2014
- Fujitsu Limited
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 8,785,256
- Issue date Jul 22, 2014
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package manufacturing method and semiconductor package
- Patent number 8,581,421
- Issue date Nov 12, 2013
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacture method
- Patent number 8,399,295
- Issue date Mar 19, 2013
- Fujitsu Limited
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,378,492
- Issue date Feb 19, 2013
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package and semiconductor p...
- Patent number 8,288,875
- Issue date Oct 16, 2012
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device and method of manuf...
- Patent number 7,763,809
- Issue date Jul 27, 2010
- Shink Electric Industries Co., Inc.
- Akio Rokugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate to which semiconductor chi...
- Patent number 7,536,780
- Issue date May 26, 2009
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device substrate, semiconductor device, and manufactu...
- Patent number 7,402,900
- Issue date Jul 22, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210202361
- Publication date Jul 1, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20180166372
- Publication date Jun 14, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20170141023
- Publication date May 18, 2017
- Shinko Electric Industries Co., Ltd.
- HIROMU ARISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTU...
- Publication number 20160174379
- Publication date Jun 16, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20160172287
- Publication date Jun 16, 2016
- Shinko Electric Industries Co., Ltd.
- Hiromu Arisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20160020163
- Publication date Jan 21, 2016
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20160007460
- Publication date Jan 7, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20150282307
- Publication date Oct 1, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150282323
- Publication date Oct 1, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate, Semiconductor Device, and Method of Manufacturing...
- Publication number 20150245473
- Publication date Aug 27, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20150179560
- Publication date Jun 25, 2015
- Shinko Electric Industries Co., LTD.
- Hiromu Arisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20150163899
- Publication date Jun 11, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...
- Publication number 20150102510
- Publication date Apr 16, 2015
- Shinko Electric Industries Co., Ltd.
- Wataru Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20150062851
- Publication date Mar 5, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20150001738
- Publication date Jan 1, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20140311771
- Publication date Oct 23, 2014
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140225275
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Wiring Substrate
- Publication number 20140150258
- Publication date Jun 5, 2014
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20130328211
- Publication date Dec 12, 2013
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUF...
- Publication number 20130249075
- Publication date Sep 26, 2013
- Shinko Electric Industries Co., Ltd.
- Akihiko Tateiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD
- Publication number 20130154102
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20130122657
- Publication date May 16, 2013
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD A...
- Publication number 20130119562
- Publication date May 16, 2013
- Shinko Electric Industries Co., LTD.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE
- Publication number 20120153457
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD
- Publication number 20110187002
- Publication date Aug 4, 2011
- FUJITSU LIMITED
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110133341
- Publication date Jun 9, 2011
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...
- Publication number 20100244280
- Publication date Sep 30, 2010
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing wiring substrate to which semiconductor chi...
- Publication number 20060131069
- Publication date Jun 22, 2006
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered circuit substrate, semiconductor device and method of...
- Publication number 20060110838
- Publication date May 25, 2006
- Shinko Electric Industries Co., Ltd.
- Akio Rokugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device substrate, semiconductor device, and manufactu...
- Publication number 20060040424
- Publication date Feb 23, 2006
- Kiyoshi Ooi
- H01 - BASIC ELECTRIC ELEMENTS

AKIO ROKUGAWA

Person

Patents Grantslast 30 patents

Wiring board and method of manufacturing the same

Wiring board and method of manufacturing the same

Wiring substrate and semiconductor device

Wiring substrate and semiconductor package

Wiring substrate and semiconductor device

Wiring board

Wiring substrate and semiconductor device

Wiring board, electronic component device, and method for manufactu...

Wiring board, semiconductor device, and method of manufacturing wir...

Wiring board and semiconductor device

Wiring substrate and method of manufacturing the same

Method of manufacturing wiring substrate

Wiring substrate and semiconductor device

Wiring substrate, semiconductor device, and method of manufacturing...

Wiring board, semiconductor device, and method of manufacturing wir...

Wiring board

Wiring board, semiconductor device, and method for manufacturing wi...

Semiconductor package, semiconductor device, and method for manufac...

Wiring board

Semiconductor package including a metal plate, semiconductor chip,...

Semiconductor package, semiconductor package manufacturing method a...

Semiconductor device and its manufacture method

Method of manufacturing semiconductor package

Semiconductor package manufacturing method and semiconductor package

Semiconductor device and its manufacture method

Semiconductor package

Method of manufacturing a semiconductor package and semiconductor p...

Multilayered substrate for semiconductor device and method of manuf...

Method of manufacturing wiring substrate to which semiconductor chi...

Semiconductor device substrate, semiconductor device, and manufactu...

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Wiring Substrate and Semiconductor Device

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTU...

WIRING BOARD AND SEMICONDUCTOR DEVICE

Wiring Substrate and Semiconductor Device

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING BOARD

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Wiring Substrate, Semiconductor Device, and Method of Manufacturing...

Wiring Substrate and Semiconductor Device

WIRING BOARD

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

WIRING BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Method of Manufacturing Wiring Substrate

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD A...

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...

Method of manufacturing wiring substrate to which semiconductor chi...

Multilayered circuit substrate, semiconductor device and method of...

Semiconductor device substrate, semiconductor device, and manufactu...