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Akio SHIMOYAMA

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  • Suita-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate evaluation chip and substrate evaluation device
    • Patent number 11,454,601
    • Issue date Sep 27, 2022
    • Osaka University
    • Katsuaki Suganuma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding device
    • Patent number 11,049,840
    • Issue date Jun 29, 2021
    • Osaka University
    • Katsuaki Suganuma
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE EVALUATION CHIP AND SUBSTRATE EVALUATION DEVICE
    • Publication number 20200378912
    • Publication date Dec 3, 2020
    • OSAKA UNIVERSITY
    • Katsuaki Suganuma
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING DEVICE
    • Publication number 20190189587
    • Publication date Jun 20, 2019
    • OSAKA UNIVERSITY
    • Katsuaki SUGANUMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR