Akio Suzuki

Person

Tano-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding material and semiconductor supporting device
- Patent number 9,631,128
- Issue date Apr 25, 2017
- NGK Insulators, Ltd.
- Tomoyuki Fujii
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat conductive silicone rubber composite sheet
- Patent number 7,537,837
- Issue date May 26, 2009
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Takei
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electromagnetic wave absorbing thermally conductive composition and...
- Patent number 7,417,078
- Issue date Aug 26, 2008
- Shin-Etsu Chemical Co., Ltd.
- Hironao Fujiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition and adhesive film
- Patent number 7,364,797
- Issue date Apr 29, 2008
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone adhesive and adhesive film
- Patent number 7,312,296
- Issue date Dec 25, 2007
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dicing/die bonding adhesion tape
- Patent number 7,244,495
- Issue date Jul 17, 2007
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicone adhesive and silicone adhesive film
- Patent number 7,125,948
- Issue date Oct 24, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat dissipating structure
- Patent number 6,663,964
- Issue date Dec 16, 2003
- Shin-Etsu Chemical Co., Ltd.
- Kunihiko Mita
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Electromagnetic wave absorbing silicone rubber compositions
- Patent number 6,617,038
- Issue date Sep 9, 2003
- Shin-Etsu Chemical Co., Ltd.
- Ikuo Sakurai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electromagnetic wave absorbing, heat conductive silicone rubber com...
- Patent number 6,514,428
- Issue date Feb 4, 2003
- Shin-Etsu Chemical Co., Ltd.
- Akio Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a product of one-piece construction wherein...
- Patent number 5,187,014
- Issue date Feb 16, 1993
- Shin-Etsu Chemical Company, Limited
- Akio Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL AND SEMICONDUCTOR SUPPORTING DEVICE
- Publication number 20080193741
- Publication date Aug 14, 2008
- NGK Insulators, Ltd.
- Tomoyuki FUJII
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition and adhesive film
- Publication number 20050065296
- Publication date Mar 24, 2005
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE ORGANOPOLYSILOXANE COMPOSITION AND ADHESIVE
- Publication number 20050032989
- Publication date Feb 10, 2005
- Shin-Etsu Chemical Co., Ltd.
- Satosi Onai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dicing/die bonding adhesion tape
- Publication number 20040213994
- Publication date Oct 28, 2004
- Shouhei Kozakai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Heat conductive silicone rubber composite sheet
- Publication number 20040067372
- Publication date Apr 8, 2004
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Takei
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Silicone adhesive and silicone adhesive film
- Publication number 20040068076
- Publication date Apr 8, 2004
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electromagnetic wave absorbing thermally conductive composition and...
- Publication number 20040054029
- Publication date Mar 18, 2004
- Hironao Fujiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicone adhesive and adhesive film
- Publication number 20040044132
- Publication date Mar 4, 2004
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Heat dissipating structure
- Publication number 20030096116
- Publication date May 22, 2003
- Shin-Etsu Chemical Co., Ltd.
- Kunihiko Mita
- B32 - LAYERED PRODUCTS
Information Patent Application
Electromagnetic wave absorbing silicone rubber compositions
- Publication number 20020077439
- Publication date Jun 20, 2002
- Ikuo Sakurai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electromagnetic wave absorbing, heat conductive silicone rubber com...
- Publication number 20010051673
- Publication date Dec 13, 2001
- Akio Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Akio Suzuki

Person

Patents Grantslast 30 patents

Bonding material and semiconductor supporting device

Heat conductive silicone rubber composite sheet

Electromagnetic wave absorbing thermally conductive composition and...

Adhesive composition and adhesive film

Silicone adhesive and adhesive film

Dicing/die bonding adhesion tape

Silicone adhesive and silicone adhesive film

Heat dissipating structure

Electromagnetic wave absorbing silicone rubber compositions

Electromagnetic wave absorbing, heat conductive silicone rubber com...

Method of manufacturing a product of one-piece construction wherein...

Patents Applicationslast 30 patents

BONDING MATERIAL AND SEMICONDUCTOR SUPPORTING DEVICE

Adhesive composition and adhesive film

HEAT-CURABLE ORGANOPOLYSILOXANE COMPOSITION AND ADHESIVE

Dicing/die bonding adhesion tape

Heat conductive silicone rubber composite sheet

Silicone adhesive and silicone adhesive film

Electromagnetic wave absorbing thermally conductive composition and...

Silicone adhesive and adhesive film

Heat dissipating structure

Electromagnetic wave absorbing silicone rubber compositions

Electromagnetic wave absorbing, heat conductive silicone rubber com...