Akio Yanai

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Yokkaichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multiheight contact via structures for a multilevel interconnect st...
- Patent number 9,691,778
- Issue date Jun 27, 2017
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiheight contact via structures for a multilevel interconnect st...
- Patent number 9,401,309
- Issue date Jul 26, 2016
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiheight electrically conductive via contacts for a multilevel i...
- Patent number 9,236,392
- Issue date Jan 12, 2016
- SanDisk Technologies Inc.
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIHEIGHT CONTACT VIA STRUCTURES FOR A MULTILEVEL INTERCONNECT ST...
- Publication number 20160307912
- Publication date Oct 20, 2016
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIHEIGHT CONTACT VIA STRUCTURES FOR A MULTILEVEL INTERCONNECT ST...
- Publication number 20160064281
- Publication date Mar 3, 2016
- SANDISK TECHNOLOGIES INC.
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS