Akira Araki

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Annaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Reclaiming processing method for delaminated wafer
- Patent number 9,496,130
- Issue date Nov 15, 2016
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RECLAIMING PROCESSING METHOD FOR DELAMINATED WAFER
- Publication number 20140273400
- Publication date Sep 18, 2014
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS