Akira Fujita

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Shiga, JP

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Patents Grantslast 30 patents

Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive paste and die bonding method
- Patent number 9,818,718
- Issue date Nov 14, 2017
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE PASTE AND DIE BONDING METHOD
- Publication number 20190139930
- Publication date May 9, 2019
- KAKEN TECH CO., LTD.
- Shigeo Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE AND DIE BONDING METHOD
- Publication number 20150115018
- Publication date Apr 30, 2015
- KAKEN TECH CO., LTD.
- Shigeo Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR