Akira FUKUI

Follow

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation substrate and method for producing heat dissipatio...
- Patent number 10,115,655
- Issue date Oct 30, 2018
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING MEMBER
- Publication number 20240290684
- Publication date Aug 29, 2024
- SUPERUFO291 TEC
- Akira FUKUI
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING MEMBER FOR SEMICONDUCTOR DEVICE
- Publication number 20230395550
- Publication date Dec 7, 2023
- SUPERUFO291 TEC
- Akira FUKUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SUBSTRATE AND METHOD FOR PRODUCING HEAT DISSIPATIO...
- Publication number 20170317009
- Publication date Nov 2, 2017
- SUPERUFO291 TEC
- Akira FUKUI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HEAT DISSIPATION SUBSTRATE AND METHOD FOR PRODUCING HEAT DISSIPATIO...
- Publication number 20160336253
- Publication date Nov 17, 2016
- SUPERUFO291 TEC
- Akira FUKUI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR