Akira Fukui

Person

Toyama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat sink substrate and production method for the same
- Patent number 8,092,914
- Issue date Jan 10, 2012
- A.L.M.T. Corp.
- Masahiro Omachi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Member for semiconductor device and production method thereof
- Patent number 7,749,430
- Issue date Jul 6, 2010
- A.L.M.T. Corp.
- Akira Fukui
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Susbstrate material for mounting a semiconductor device, substrate...
- Patent number 6,974,558
- Issue date Dec 13, 2005
- Sumotomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Aluminum-silicon carbide semiconductor substrate and method for pro...
- Patent number 6,876,075
- Issue date Apr 5, 2005
- Sumitomo Electric Industries, Ltd.
- Akira Fukui
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat-dissipating substrate, method for making the same, and semicon...
- Patent number 6,764,773
- Issue date Jul 20, 2004
- Sumitomo Electric Industrial Co., Ltd.
- Masahiro Omachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material and semiconductor device using the same
- Patent number 6,737,168
- Issue date May 18, 2004
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate material for mounting a semiconductor device, substrate f...
- Patent number 6,534,190
- Issue date Mar 18, 2003
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Member for semiconductor device and method for producing the same
- Patent number 6,507,105
- Issue date Jan 14, 2003
- Sumitomo Electric Industries, Ltd.
- Shin-ichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Substrate material for mounting a semiconductor device, substrate f...
- Patent number 6,388,273
- Issue date May 14, 2002
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Silicon carbide based composite material and manufacturing method t...
- Patent number 6,280,496
- Issue date Aug 28, 2001
- Sumitomo Electric Industries, Ltd.
- Chihiro Kawai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate material for mounting a semiconductor device, substrate f...
- Patent number 6,183,874
- Issue date Feb 6, 2001
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Aluminum base member for semiconductor device containing a nitrogen...
- Patent number 6,123,895
- Issue date Sep 26, 2000
- Sumitomo Electric Industries, Ltd.
- Shin-ichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Plate type member for semiconductor device package and package
- Patent number 5,990,548
- Issue date Nov 23, 1999
- Sumitomo Electric Industries, Ltd.
- Mitsunori Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric contact materials
- Patent number 4,457,780
- Issue date Jul 3, 1984
- Sumitomo Electric Industries, Ltd.
- Mitsuo Osada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Member for Semiconductor Device and Production Method Thereof
- Publication number 20080122052
- Publication date May 29, 2008
- Akira Fukui
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Heat sink substrate and production method for the same
- Publication number 20070252267
- Publication date Nov 1, 2007
- A.L.M.T. CORP.
- Masahiro Omachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate material for mounting a semiconductor device, substrate f...
- Publication number 20050025654
- Publication date Feb 3, 2005
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Heat-dissipating substrate, method for making the same, and semicon...
- Publication number 20030113578
- Publication date Jun 19, 2003
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Masahiro Omachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum-silicon carbide semiconductor substrate and method for pro...
- Publication number 20020195690
- Publication date Dec 26, 2002
- Akira Fukui
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Susbstrate material for mounting a semiconductor device, substrate...
- Publication number 20020034651
- Publication date Mar 21, 2002
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Akira Fukui

Person

Patents Grantslast 30 patents

Heat sink substrate and production method for the same

Member for semiconductor device and production method thereof

Susbstrate material for mounting a semiconductor device, substrate...

Aluminum-silicon carbide semiconductor substrate and method for pro...

Heat-dissipating substrate, method for making the same, and semicon...

Composite material and semiconductor device using the same

Substrate material for mounting a semiconductor device, substrate f...

Member for semiconductor device and method for producing the same

Substrate material for mounting a semiconductor device, substrate f...

Silicon carbide based composite material and manufacturing method t...

Substrate material for mounting a semiconductor device, substrate f...

Aluminum base member for semiconductor device containing a nitrogen...

Plate type member for semiconductor device package and package

Electric contact materials

Patents Applicationslast 30 patents

Member for Semiconductor Device and Production Method Thereof

Heat sink substrate and production method for the same

Substrate material for mounting a semiconductor device, substrate f...

Heat-dissipating substrate, method for making the same, and semicon...

Aluminum-silicon carbide semiconductor substrate and method for pro...

Susbstrate material for mounting a semiconductor device, substrate...