Akira Fukuizumi

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with uneven metal plate to improve adhesion to...
- Patent number 6,849,930
- Issue date Feb 1, 2005
- NEC Corporation
- Yoshihiro Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive hardening resin for a semiconductor device and semicondu...
- Patent number 6,747,360
- Issue date Jun 8, 2004
- NEC Electronics Corporation
- Akira Fukuizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive paste and semiconductor device prepared by...
- Patent number 6,733,695
- Issue date May 11, 2004
- Sumitomo Bakelite Company LTD
- Kazuto Onami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,720,647
- Issue date Apr 13, 2004
- NEC Electronics Corporation
- Akira Fukuizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive hardening resin for a semiconductor device and semicondu...
- Patent number 6,613,829
- Issue date Sep 2, 2003
- NEC Electronics Corporation
- Akira Fukuizumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Conductive hardening resin for a semiconductor device and semicondu...
- Publication number 20030214032
- Publication date Nov 20, 2003
- NEC ELECTRONICS CORPORATION
- Akira Fukuizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically conductive paste and semiconductor device prepared by...
- Publication number 20030122257
- Publication date Jul 3, 2003
- Kazuto Onami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive hardening resin for a semiconductor device and semicondu...
- Publication number 20020098625
- Publication date Jul 25, 2002
- NEC Corporation
- Akira Fukuizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020047187
- Publication date Apr 25, 2002
- NEC Corporation
- Yoshihiro Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20010048156
- Publication date Dec 6, 2001
- NEC Corporation
- Akira Fukuizumi
- H01 - BASIC ELECTRIC ELEMENTS