Akira Ichida

Person

Toyama-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for producing heat-radiating subst...
- Patent number 6,926,861
- Issue date Aug 9, 2005
- Tokyo Tungsten Co., Ltd.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package and method for producing heat-radiating subst...
- Patent number 6,693,353
- Issue date Feb 17, 2004
- Tokyo Tungsten Co., Ltd.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Plasma facing components of nuclear fusion reactors employing tungs...
- Patent number 6,610,375
- Issue date Aug 26, 2003
- Japan Atomic Energy Research Institute
- Masato Akiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package using micro balls and production method thereof
- Patent number 6,518,667
- Issue date Feb 11, 2003
- Allied Material Corporation
- Akira Ichida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink substrate consisting essentially of copper and molybdenum...
- Patent number 6,475,429
- Issue date Nov 5, 2002
- Tokyo Tungsten Co., Ltd.
- Mitsuo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat sink substrate consisting essentially of copper and molybdenum...
- Patent number 6,271,585
- Issue date Aug 7, 2001
- Tokyo Tungsten Co., Ltd.
- Mitsuo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Plasma facing components of nuclear fusion reactors employing tungs...
- Patent number 6,261,648
- Issue date Jul 17, 2001
- Japan Atomic Energy Research Institute
- Masato Akiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plastic-packaged semiconductor device having a heat sink matched wi...
- Patent number 5,493,153
- Issue date Feb 20, 1996
- Tokyo Tungsten Co., Ltd.
- Tadashi Arikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package and method for producing heat-radiating subst...
- Publication number 20040056352
- Publication date Mar 25, 2004
- TOKYO TUNGSTEN CO., LTD.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Heat sink substrate consisting essentially of copper and molybdenum...
- Publication number 20020017346
- Publication date Feb 14, 2002
- Mitsuo Osada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Plasma facing components of nuclear fusion reactors employing tungs...
- Publication number 20020015466
- Publication date Feb 7, 2002
- Masato Akiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Akira Ichida

Person

Patents Grantslast 30 patents

Semiconductor package and method for producing heat-radiating subst...

Semiconductor package and method for producing heat-radiating subst...

Plasma facing components of nuclear fusion reactors employing tungs...

Semiconductor package using micro balls and production method thereof

Heat sink substrate consisting essentially of copper and molybdenum...

Heat sink substrate consisting essentially of copper and molybdenum...

Plasma facing components of nuclear fusion reactors employing tungs...

Plastic-packaged semiconductor device having a heat sink matched wi...

Patents Applicationslast 30 patents

Semiconductor package and method for producing heat-radiating subst...

Heat sink substrate consisting essentially of copper and molybdenum...

Plasma facing components of nuclear fusion reactors employing tungs...