Akira Ichiryu

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Process for producing a collapsed filled via hole
- Patent number 7,178,233
- Issue date Feb 20, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Toshiyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN...
- Patent number 6,905,757
- Issue date Jun 14, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
2-Metal layer TAB tape and both-sided CSP•BGA tape
- Patent number 6,798,048
- Issue date Sep 28, 2004
- Mitsui Mining and Smelting Company, Ltd.
- Akira Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING DIELECTRIC FILM AND METHOD FOR PRODUCING CAPAC...
- Publication number 20110013342
- Publication date Jan 20, 2011
- TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION ADMINISTRATIVE ORGANIZATION
- Yasushi Idemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Resin containing dielectric filler for formation of built-in capact...
- Publication number 20040147658
- Publication date Jul 29, 2004
- Toshifumi Matsushima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for producing a printed wiring board-forming sheet and mult...
- Publication number 20040111882
- Publication date Jun 17, 2004
- Toshiyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board,its manufacturing method and csp manufacturin...
- Publication number 20040099441
- Publication date May 27, 2004
- Akira Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and production method therefor, and laminated...
- Publication number 20040026122
- Publication date Feb 12, 2004
- Katsuhiko Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Two-metal tab tape, double-sided csp tape, bga tape and method for...
- Publication number 20020187334
- Publication date Dec 12, 2002
- Akira Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS

Akira Ichiryu

Person

Patents Grantslast 30 patents

Process for producing a collapsed filled via hole

DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN...

2-Metal layer TAB tape and both-sided CSP&#x02022;BGA tape

Patents Applicationslast 30 patents

METHOD FOR PRODUCING DIELECTRIC FILM AND METHOD FOR PRODUCING CAPAC...

Resin containing dielectric filler for formation of built-in capact...

Process for producing a printed wiring board-forming sheet and mult...

Printed circuit board,its manufacturing method and csp manufacturin...

Printed circuit board and production method therefor, and laminated...

Two-metal tab tape, double-sided csp tape, bga tape and method for...

2-Metal layer TAB tape and both-sided CSP•BGA tape