Akira Ishizu

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Amagasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for preparing a combined wiring substrate
- Patent number 5,069,745
- Issue date Dec 3, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Hirofumi Ohuchida
- G02 - OPTICS
Information Patent Grant
Thin film semiconductor device with oxide film on insulating layer
- Patent number 4,984,033
- Issue date Jan 8, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Akira Ishizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing device for electrical circuit boards
- Patent number 4,943,768
- Issue date Jul 24, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Niki
- G01 - MEASURING TESTING
Information Patent Grant
Testing device for electrical circuit boards
- Patent number 4,887,030
- Issue date Dec 12, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Niki
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing a thin film semiconductor device
- Patent number 4,822,751
- Issue date Apr 18, 1989
- Mitsubishi Denki Kabushi Kaisha
- Akira Ishizu
- H01 - BASIC ELECTRIC ELEMENTS