Akira KAGEYAMA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,977,099
- Issue date May 7, 2024
- HITACHI HIGH-TECH CORPORATION
- Tomohisa Ohtaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Evaluation apparatus for semiconductor device
- Patent number 11,709,199
- Issue date Jul 25, 2023
- HITACHI HIGH-TECH CORPORATION
- Tomohisa Ohtaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe module and probe
- Patent number 11,391,756
- Issue date Jul 19, 2022
- HITACHI HIGH-TECH CORPORATION
- Ryo Hirano
- G01 - MEASURING TESTING
Information Patent Grant
Circuit inspection method and sample inspection apparatus
- Patent number 10,712,384
- Issue date Jul 14, 2020
- HITACHI HIGH-TECH CORPORATION
- Akira Kageyama
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Sample Inspection Apparatus
- Publication number 20240255556
- Publication date Aug 1, 2024
- Hitachi High-Tech Corporation
- Tomoko SHIMAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Device
- Publication number 20210048450
- Publication date Feb 18, 2021
- Hitachi High-Tech Corporation
- Tomohisa OHTAKI
- G01 - MEASURING TESTING
Information Patent Application
Probe Module and Probe
- Publication number 20210033642
- Publication date Feb 4, 2021
- Hitachi High-Tech Corporation
- Ryo HIRANO
- G01 - MEASURING TESTING
Information Patent Application
Evaluation Apparatus for Semiconductor Device
- Publication number 20210025936
- Publication date Jan 28, 2021
- Hitachi High-Tech Corporation
- Tomohisa OHTAKI
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT INSPECTION METHOD AND SAMPLE INSPECTION APPARATUS
- Publication number 20180246166
- Publication date Aug 30, 2018
- Hitachi High-Technologies Corporation
- Akira KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS