Akira Matsuda

Person

Nikko, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Network system and configuration method therefor
- Patent number 11,425,023
- Issue date Aug 23, 2022
- Nippon Telegraph and Telephone Corporation
- Akira Matsuda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Relay device and relay method
- Patent number 11,388,076
- Issue date Jul 12, 2022
- Nippon Telegraph and Telephone Corporation
- Akira Matsuda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Relay device and relay method
- Patent number 11,349,744
- Issue date May 31, 2022
- Nippon Telegraph and Telephone Corporation
- Akira Matsuda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Connector system capable of mitigating signal deterioration
- Patent number 9,893,475
- Issue date Feb 13, 2018
- Sony Corporation
- Kazuaki Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire connection device, camera head and endoscopic device
- Patent number 9,833,127
- Issue date Dec 5, 2017
- Sony Olympus Medical Solutions Inc.
- Kei Tomatsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Connector, data transmitting apparatus, data receiving apparatus, a...
- Patent number 9,698,539
- Issue date Jul 4, 2017
- Sony Corporation
- Kazuaki Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oligonucleotide, glucocorticoid sensitivity enhancer, pharmaceutica...
- Patent number 9,234,200
- Issue date Jan 12, 2016
- NATIONAL UNIVERSITY OF CORPORATION TOKYO UNIVERSITY OF AGRICULTURE AND TECHNO...
- Akane Tanaka
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Copper foil for high frequency circuit, method of production and ap...
- Patent number 7,985,485
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Takami Moteki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing a circuit board material having a conductive b...
- Patent number 7,794,578
- Issue date Sep 14, 2010
- The Furukawa Electric Co., Ltd.
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing ultra-thin copper foil with carrier, ultra-thin...
- Patent number 7,223,481
- Issue date May 29, 2007
- Furukawa Circuit Foil Co., Inc.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substrate with resistance layer, resistance board, and r...
- Patent number 7,215,235
- Issue date May 8, 2007
- Furukawa Circuit Foil Co., LTD
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin copper foil with carrier, method of production of same,...
- Patent number 6,924,043
- Issue date Aug 2, 2005
- Furkawa Circuit Foil Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead material for electronic part, lead and semiconductor device us...
- Patent number RE38588
- Issue date Sep 14, 2004
- The Furukawa Electric Co., Ltd.
- Morimasa Tanimoto
- 428 - Stock material or miscellaneous articles
Information Patent Grant
Plated material, method of producing same, and electrical/electroni...
- Patent number 6,770,383
- Issue date Aug 3, 2004
- The Furukawa Electric Co., Ltd.
- Hitoshi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heavy duty pneumatic tire
- Patent number 6,602,943
- Issue date Aug 5, 2003
- Bridgestone Corporation
- Tomohiro Kusano
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Lead material for electronic part, lead and semiconductor device us...
- Patent number 6,110,608
- Issue date Aug 29, 2000
- The Furukawa Electric Co., Ltd.
- Morimasa Tanimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Process for producing elastomeric compound having reduced hysteresis
- Patent number 5,698,646
- Issue date Dec 16, 1997
- Bridgestone Corporation
- Takashi Kitamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plating method for a nickel-titanium alloy member
- Patent number 5,464,524
- Issue date Nov 7, 1995
- The Furukawa Electric Co., Ltd.
- Yoshiaki Ogiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electric contact material and electric contact using said material
- Patent number 5,338,618
- Issue date Aug 16, 1994
- The Furukawa Electric Co., Ltd.
- Satoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of continuously processing wire material and device therefor
- Patent number 5,334,294
- Issue date Aug 2, 1994
- The Furokawa Electric Co., Ltd.
- Hirohisa Iwai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electric contact material and electric contact using said material
- Patent number 5,171,643
- Issue date Dec 15, 1992
- The Furukawa Electric Co., Ltd.
- Satoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical fiber cable coated with conductive metal coating and proces...
- Patent number 5,093,880
- Issue date Mar 3, 1992
- Furukawa Electric Co., Ltd.
- Akira Matsuda
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Copper radiator for motor cars excellent in corrosion resistance an...
- Patent number 4,898,318
- Issue date Feb 6, 1990
- The Furukawa Electric Co., Ltd.
- Syoji Shiga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fin of heat exchanger and method of making it
- Patent number 4,892,141
- Issue date Jan 9, 1990
- The Furukawa Electric Co., Ltd.
- Shoji Shiga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper radiator for motor cars excellent in corrosion resistance an...
- Patent number 4,775,004
- Issue date Oct 4, 1988
- The Furukawa Electric Co., Ltd.
- Syoji Shiga
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
RELAY DEVICE AND RELAY METHOD
- Publication number 20210344583
- Publication date Nov 4, 2021
- Nippon Telegraph and Telephone Corporation
- Akira MATSUDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
NETWORK SYSTEM AND CONFIGURATION METHOD THEREFOR
- Publication number 20210014151
- Publication date Jan 14, 2021
- Nippon Telegraph and Telephone Corporation
- Akira Matsuda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CONNECTOR, DATA TRANSMITTING APPARATUS, DATA RECEIVING APPARATUS, A...
- Publication number 20160087377
- Publication date Mar 24, 2016
- SONY CORPORATION
- KAZUAKI TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR, DATA RECEIVING APPARATUS, DATA TRANSMITTING APPARATUS, A...
- Publication number 20150333456
- Publication date Nov 19, 2015
- SONY CORPORATION
- KAZUAKI TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE CONNECTION DEVICE, CAMERA HEAD AND ENDOSCOPIC DEVICE
- Publication number 20150250378
- Publication date Sep 10, 2015
- SONY OLYMPUS MEDICAL SOLUTIONS INC.
- Kei TOMATSU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
OLIGONUCLEOTIDE, GLUCOCORTICOID SENSITIVITY ENHANCER, PHARMACEUTICA...
- Publication number 20150118744
- Publication date Apr 30, 2015
- NATIONAL UNIVERSITY CORPORATION TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY
- Akane Tanaka
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING TH...
- Publication number 20130099270
- Publication date Apr 25, 2013
- FURUKAWA ELECTRIC CO., LTD.
- Yoshiaki KOBAYASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...
- Publication number 20110171486
- Publication date Jul 14, 2011
- THE FURUKAWA ELECTRIC CO., LTD.
- Takami MOTEKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...
- Publication number 20090324988
- Publication date Dec 31, 2009
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high frequency circuit, method of production and ap...
- Publication number 20070042212
- Publication date Feb 22, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composite copper foil, method of production thereof and high freque...
- Publication number 20060147742
- Publication date Jul 6, 2006
- Akira Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conductive base material with resistance layer and circuit board ma...
- Publication number 20050280498
- Publication date Dec 22, 2005
- Yuuki Kikuchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of producing ultra-thin copper foil with carrier, ultra-thin...
- Publication number 20050048306
- Publication date Mar 3, 2005
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high frequency circuit, method of production and ap...
- Publication number 20050019599
- Publication date Jan 27, 2005
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conductive substrate with resistance layer, resistance board, and r...
- Publication number 20040201446
- Publication date Oct 14, 2004
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating bath for forming thin resistance layer, method of formation...
- Publication number 20040144656
- Publication date Jul 29, 2004
- Akira Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultra-thin copper foil with carrier, method of production of same,...
- Publication number 20040121178
- Publication date Jun 24, 2004
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plated material, method of producing same, and electrical/electroni...
- Publication number 20030091855
- Publication date May 15, 2003
- Hitoshi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEAVY DUTY PNEUMATIC TIRE
- Publication number 20010053811
- Publication date Dec 20, 2001
- Bridgestone Corporation
- TOMOHIRO KUSANO
- B60 - VEHICLES IN GENERAL

Akira Matsuda

Person

Patents Grantslast 30 patents

Network system and configuration method therefor

Relay device and relay method

Relay device and relay method

Connector system capable of mitigating signal deterioration

Wire connection device, camera head and endoscopic device

Connector, data transmitting apparatus, data receiving apparatus, a...

Oligonucleotide, glucocorticoid sensitivity enhancer, pharmaceutica...

Copper foil for high frequency circuit, method of production and ap...

Method for preparing a circuit board material having a conductive b...

Method of producing ultra-thin copper foil with carrier, ultra-thin...

Conductive substrate with resistance layer, resistance board, and r...

Ultra-thin copper foil with carrier, method of production of same,...

Lead material for electronic part, lead and semiconductor device us...

Plated material, method of producing same, and electrical/electroni...

Heavy duty pneumatic tire

Lead material for electronic part, lead and semiconductor device us...

Process for producing elastomeric compound having reduced hysteresis

Plating method for a nickel-titanium alloy member

Electric contact material and electric contact using said material

Method of continuously processing wire material and device therefor

Electric contact material and electric contact using said material

Optical fiber cable coated with conductive metal coating and proces...

Copper radiator for motor cars excellent in corrosion resistance an...

Fin of heat exchanger and method of making it

Copper radiator for motor cars excellent in corrosion resistance an...

Patents Applicationslast 30 patents

RELAY DEVICE AND RELAY METHOD

NETWORK SYSTEM AND CONFIGURATION METHOD THEREFOR

CONNECTOR, DATA TRANSMITTING APPARATUS, DATA RECEIVING APPARATUS, A...

CONNECTOR, DATA RECEIVING APPARATUS, DATA TRANSMITTING APPARATUS, A...

WIRE CONNECTION DEVICE, CAMERA HEAD AND ENDOSCOPIC DEVICE

OLIGONUCLEOTIDE, GLUCOCORTICOID SENSITIVITY ENHANCER, PHARMACEUTICA...

LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING TH...

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...

Copper foil for high frequency circuit, method of production and ap...

Composite copper foil, method of production thereof and high freque...

Conductive base material with resistance layer and circuit board ma...

Method of producing ultra-thin copper foil with carrier, ultra-thin...

Copper foil for high frequency circuit, method of production and ap...

Conductive substrate with resistance layer, resistance board, and r...

Plating bath for forming thin resistance layer, method of formation...

Ultra-thin copper foil with carrier, method of production of same,...

Plated material, method of producing same, and electrical/electroni...

HEAVY DUTY PNEUMATIC TIRE