Akira Matsuda

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Gunma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Integrally molded article of silicone rubber and modified polypropy...
- Patent number 5,418,065
- Issue date May 23, 1995
- Shin-Etsu Chemical Co., Ltd.
- Hironao Fujiki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Adhesive silicone rubber compositions
- Patent number 5,405,896
- Issue date Apr 11, 1995
- Shin-Etsu Chemical Co., Ltd.
- Hironao Fujiki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polycarbonate resin/silicone rubber integrally molded article and m...
- Patent number 5,366,805
- Issue date Nov 22, 1994
- Shin-Etsu Chemical Company, Ltd.
- Hironao Fujiki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of chucking semiconductor wafers
- Patent number 5,335,457
- Issue date Aug 9, 1994
- Shin-Etsu Handotai Co., Ltd.
- Akira Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral packing/covering member for hard-disc unit
- Patent number 5,258,212
- Issue date Nov 2, 1993
- Shin-Etsu Chemical Co., Ltd.
- Kazuhiko Tomaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...