Akira Matsunaga

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Hitachi, JP

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Patents Grantslast 30 patents

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Glass-moulded type semiconductor device
- Patent number 4,430,664
- Issue date Feb 7, 1984
- Hitachi, Ltd.
- Akira Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass-encapsulated semiconductor device containing cylindrical stac...
- Patent number 4,148,056
- Issue date Apr 3, 1979
- Hitachi, Ltd.
- Akira Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS