Akira Matsunami

Person

Beppu City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ball film for integrated circuit fabrication and testing
- Patent number 7,452,799
- Issue date Nov 18, 2008
- Texas Instruments Incorporated
- Akira Matsunami
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package structure with gap through lead bar betw...
- Patent number 7,439,612
- Issue date Oct 21, 2008
- Texas Instruments Incorporated
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for attaching an IC package to a PCB assembly
- Patent number 7,371,673
- Issue date May 13, 2008
- Texas Instruments Incorporated
- Akira Matsunami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for forming one or more integrated circuit packag...
- Patent number 7,132,314
- Issue date Nov 7, 2006
- Texas Instruments Incorporated
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball film for integrated circuit fabrication and testing
- Patent number 7,078,821
- Issue date Jul 18, 2006
- Texas Instruments Incorporated
- Akira Matsunami
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for integrated circuit packaging
- Patent number 6,969,641
- Issue date Nov 29, 2005
- Texas Instruments Incorporated
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ball grid array substrate package and solder pad
- Publication number 20090085207
- Publication date Apr 2, 2009
- Texas Instruments, Inc.
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BALL FILM FOR INTEGRATED CIRCUIT FABRICATION AND TESTING
- Publication number 20090075404
- Publication date Mar 19, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- G01 - MEASURING TESTING
Information Patent Application
One piece method for integrated circuit (IC) assembly
- Publication number 20080299685
- Publication date Dec 4, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Probe test system and method for testing a semiconductor package
- Publication number 20080290885
- Publication date Nov 27, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Package Block Mold and Method
- Publication number 20080153208
- Publication date Jun 26, 2008
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderability Improvement Method for Leaded Semiconductor Package
- Publication number 20080006937
- Publication date Jan 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and Method for Forming One or More Integrated Circuit Packag...
- Publication number 20070034996
- Publication date Feb 15, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for attaching an IC package to a PCB assembly
- Publication number 20060263929
- Publication date Nov 23, 2006
- Texas Instruments Inc.
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Ball Film For Integrated Circuit Fabrication and Testing
- Publication number 20060258141
- Publication date Nov 16, 2006
- Akira Matsunami
- G01 - MEASURING TESTING
Information Patent Application
Flexible leaded stacked semiconductor package
- Publication number 20060091516
- Publication date May 4, 2006
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder ball opening protrusion for semiconductor assembly
- Publication number 20060022339
- Publication date Feb 2, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and method for forming one or more integrated circuit packag...
- Publication number 20050263862
- Publication date Dec 1, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for marking the surface of a semiconductor package
- Publication number 20050054126
- Publication date Mar 10, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printing one or more electrically conductive bonding lines to provi...
- Publication number 20050048680
- Publication date Mar 3, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for integrated circuit packaging
- Publication number 20050048699
- Publication date Mar 3, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball film for integrated circuit fabrication and testing
- Publication number 20050048756
- Publication date Mar 3, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- G01 - MEASURING TESTING

Akira Matsunami

Person

Patents Grantslast 30 patents

Ball film for integrated circuit fabrication and testing

Integrated circuit package structure with gap through lead bar betw...

Method and apparatus for attaching an IC package to a PCB assembly

System and method for forming one or more integrated circuit packag...

Ball film for integrated circuit fabrication and testing

Method and system for integrated circuit packaging

Patents Applicationslast 30 patents

Ball grid array substrate package and solder pad

BALL FILM FOR INTEGRATED CIRCUIT FABRICATION AND TESTING

One piece method for integrated circuit (IC) assembly

Probe test system and method for testing a semiconductor package

Semiconductor Package Block Mold and Method

Solderability Improvement Method for Leaded Semiconductor Package

System and Method for Forming One or More Integrated Circuit Packag...

Method and apparatus for attaching an IC package to a PCB assembly

Ball Film For Integrated Circuit Fabrication and Testing

Flexible leaded stacked semiconductor package

Solder ball opening protrusion for semiconductor assembly

System and method for forming one or more integrated circuit packag...

System and method for marking the surface of a semiconductor package

Printing one or more electrically conductive bonding lines to provi...

Method and system for integrated circuit packaging

Ball film for integrated circuit fabrication and testing