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Akira Matsuo
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Yokohama, JP
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last 30 patents
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Patent Grant
Process for regenerating chemical copper plating solution
Patent number
4,324,629
Issue date
Apr 13, 1982
Hitachi, Ltd.
Hitoshi Oka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Method for automatically controlling composition of chemical copper...
Patent number
4,310,563
Issue date
Jan 12, 1982
Hitachi, Ltd.
Hitoshi Oka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Electroless copper plating solution
Patent number
4,303,443
Issue date
Dec 1, 1981
Hitachi, Ltd.
Osamu Miyazawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...