Akira Matsuura

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board, method for manufacturing wiring board and electronic...
- Patent number 7,268,408
- Issue date Sep 11, 2007
- Hitachi Cable Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board utilizing a conductive member...
- Patent number 6,943,100
- Issue date Sep 13, 2005
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board utilizing a conductive member having a reduced thickness
- Patent number 6,670,718
- Issue date Dec 30, 2003
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wiring board, semiconductor device, and process for production of w...
- Publication number 20040080054
- Publication date Apr 29, 2004
- HITACHI CABLE, LTD.
- Akira Chinda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board, method for manufacturing wiring board and electronic...
- Publication number 20030178713
- Publication date Sep 25, 2003
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, semiconductor device, and process for production of w...
- Publication number 20020074667
- Publication date Jun 20, 2002
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS