Akira Mochida

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer printed wiring board
- Patent number 8,563,420
- Issue date Oct 22, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,253,030
- Issue date Aug 28, 2012
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,124,882
- Issue date Feb 28, 2012
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 8,093,508
- Issue date Jan 10, 2012
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 7,982,139
- Issue date Jul 19, 2011
- Ibiden Co. Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,856,710
- Issue date Dec 28, 2010
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 7,480,150
- Issue date Jan 20, 2009
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20120302010
- Publication date Nov 29, 2012
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20110063811
- Publication date Mar 17, 2011
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100193227
- Publication date Aug 5, 2010
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20090200069
- Publication date Aug 13, 2009
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080104833
- Publication date May 8, 2008
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070105278
- Publication date May 10, 2007
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board
- Publication number 20060137905
- Publication date Jun 29, 2006
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Akira Mochida

Person

Patents Grantslast 30 patents

Multilayer printed wiring board

Multilayer printed wiring board

Multilayer printed wiring board

Printed wiring board and method of manufacturing the same

Multilayer printed wiring board

Method of manufacturing printed wiring board

Printed wiring board and method of manufacturing the same

Patents Applicationslast 30 patents

MULTILAYER PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Multilayer printed wiring board