Akira Morita

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer treating apparatus
- Patent number 7,758,717
- Issue date Jul 20, 2010
- Dainippon Screen Mfg. Co., Ltd.
- Koji Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus
- Patent number 7,422,681
- Issue date Sep 9, 2008
- Dainippon Screen Mfg. Co., Ltd.
- Toshio Hiroe
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Substrate treating apparatus
- Patent number 7,160,416
- Issue date Jan 9, 2007
- Dainippon Screen Mfg. Co., Ltd.
- Koji Hasegawa
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
Wafer treating apparatus
- Publication number 20060191635
- Publication date Aug 31, 2006
- Dainippon Screen Mfg. Co., Ltd.
- Koji Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate treating apparatus
- Publication number 20050258085
- Publication date Nov 24, 2005
- Dainippon Screen Mfg. Co., Ltd.
- Toshio Hiroe
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
Substrate treating apparatus
- Publication number 20050217793
- Publication date Oct 6, 2005
- Dainippon Screen Mfg. Co., Ltd.
- Koji Hasegawa
- B08 - CLEANING
Information Patent Application
Substrate treating method and apparatus
- Publication number 20040242004
- Publication date Dec 2, 2004
- Dainippon Screen Mfg. Co., Ltd.
- Hajime Shirakawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...