Akira Morozumi

Person

Okaya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with reinforcing board
- Patent number 10,461,012
- Issue date Oct 29, 2019
- Fuji Electric Co., Ltd.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and manufacturing method of semiconductor module
- Patent number 10,128,167
- Issue date Nov 13, 2018
- Fuji Electric Co., Ltd.
- Akira Morozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooler
- Patent number 9,673,130
- Issue date Jun 6, 2017
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module cooler and semiconductor module
- Patent number 9,293,391
- Issue date Mar 22, 2016
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for producing semiconductor device
- Patent number 9,269,644
- Issue date Feb 23, 2016
- Fuji Electric Co., Ltd.
- Yoshitaka Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,263,367
- Issue date Feb 16, 2016
- Honda Motor Co., Ltd.
- Takaki Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device for semiconductor module, and semiconductor module
- Patent number 9,245,821
- Issue date Jan 26, 2016
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor module cooler and semiconductor module
- Patent number 9,237,676
- Issue date Jan 12, 2016
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and heat radiation member
- Patent number 9,179,578
- Issue date Nov 3, 2015
- Fuji Electric Co., Ltd.
- Shin Soyano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and cooling unit
- Patent number 8,933,557
- Issue date Jan 13, 2015
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and cooler
- Patent number 8,902,589
- Issue date Dec 2, 2014
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 8,673,691
- Issue date Mar 18, 2014
- Fuji Electric Co., Ltd.
- Yoshinari Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,450,845
- Issue date May 28, 2013
- Fuji Electric Co., Ltd.
- Yoshinari Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device using a solder alloy
- Patent number 7,816,249
- Issue date Oct 19, 2010
- Fuji Electric Systems Co., Ltd.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,781,258
- Issue date Aug 24, 2010
- Fuji Electric Systems Co., Ltd.
- Susumu Toba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,514,785
- Issue date Apr 7, 2009
- Fuji Electric Device Technology Co., Ltd.
- Susumu Toba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module
- Patent number 6,914,325
- Issue date Jul 5, 2005
- Fuji Electric Co. Ltd.
- Takatoshi Kobayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,905,063
- Issue date Jun 14, 2005
- Fuji Electric Co., Ltd.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of relaxing thermal stress
- Patent number 6,844,621
- Issue date Jan 18, 2005
- Fuji Electric Co., Ltd.
- Akira Morozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module ceramic substrate with upper and lower p...
- Patent number 6,690,087
- Issue date Feb 10, 2004
- Fuji Electric Co., Ltd.
- Takatoshi Kobayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Insulation substrate for a semiconductor device
- Patent number 5,869,890
- Issue date Feb 9, 1999
- Fuji Electric Co., Ltd.
- Masaharu Nishiura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Zirconia-added alumina substrate with direct bonding of copper
- Patent number 5,675,181
- Issue date Oct 7, 1997
- Fuji Electric Co., Ltd.
- Masaharu Nishiura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230420318
- Publication date Dec 28, 2023
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230067725
- Publication date Mar 2, 2023
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
- Publication number 20170271239
- Publication date Sep 21, 2017
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160343640
- Publication date Nov 24, 2016
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE UNIT AND SEMICONDUCTOR MODULE
- Publication number 20160190033
- Publication date Jun 30, 2016
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150102480
- Publication date Apr 16, 2015
- Fuji Electric Co., Ltd.
- Takaki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150008574
- Publication date Jan 8, 2015
- Fuji Electric Co., Ltd.
- Hiromichi GOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COOLER AND SEMICONDUCTOR MODULE
- Publication number 20140252590
- Publication date Sep 11, 2014
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING DEVICE FOR SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE
- Publication number 20140239486
- Publication date Aug 28, 2014
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR PRODUCING THE SAME
- Publication number 20140080262
- Publication date Mar 20, 2014
- Fuji Electric Co., Ltd.
- Yoshitaka NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COOLER AND SEMICONDUCTOR MODULE
- Publication number 20140043765
- Publication date Feb 13, 2014
- FUJI ELECTRIC CO., LTD.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20130267064
- Publication date Oct 10, 2013
- Fuji Electric Co., Ltd.
- Yoshinari IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND COOLER
- Publication number 20130058041
- Publication date Mar 7, 2013
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND HEAT RADIATION MEMBER
- Publication number 20120140420
- Publication date Jun 7, 2012
- FUJI ELECTRIC CO., LTD.
- Shin Soyano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE AND COOLING UNIT
- Publication number 20120139096
- Publication date Jun 7, 2012
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110037166
- Publication date Feb 17, 2011
- Fuji Electric Systems Co., Ltd.
- Yoshinari Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20090289344
- Publication date Nov 26, 2009
- Fuji Electric Device Technology Co., LTD.
- Akira Morozumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor module
- Publication number 20090166851
- Publication date Jul 2, 2009
- Fuji Electric Co., Ltd.
- Takatoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20090130800
- Publication date May 21, 2009
- Fuji Electric Device Technology Co., LTD.
- Susumu Toba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a semiconductor device using a solder alloy
- Publication number 20090093109
- Publication date Apr 9, 2009
- Fuji Electric Device Technology Co., LTD.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder alloy and a semiconductor device using the solder alloy
- Publication number 20060263235
- Publication date Nov 23, 2006
- Fuji Electric Device Technology Co., LTD.
- Akira Morozumi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060186520
- Publication date Aug 24, 2006
- Fuji Electric Device Technology Co., LTD.
- Susumu Toba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20060157862
- Publication date Jul 20, 2006
- Fuji Electric Device Technology, Co., Ltd.
- Yoshitaka Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor module
- Publication number 20050218426
- Publication date Oct 6, 2005
- Fuji Electric Co., Ltd.
- Takatoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of relaxing thermal stress
- Publication number 20040102023
- Publication date May 27, 2004
- Fuji Electric Co., Ltd.
- Akira Morozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module
- Publication number 20040017005
- Publication date Jan 29, 2004
- Fuji Electric Co., Ltd.
- Takatoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20030222126
- Publication date Dec 4, 2003
- Fuji Electric Co., Ltd.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor module
- Publication number 20020109152
- Publication date Aug 15, 2002
- Takatoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Akira Morozumi

Person

Patents Grantslast 30 patents

Semiconductor module with reinforcing board

Semiconductor module and manufacturing method of semiconductor module

Semiconductor device having a cooler

Semiconductor module cooler and semiconductor module

Method for producing semiconductor device

Semiconductor device

Cooling device for semiconductor module, and semiconductor module

Semiconductor module cooler and semiconductor module

Semiconductor module and heat radiation member

Semiconductor module and cooling unit

Semiconductor module and cooler

Method for manufacturing a semiconductor device

Semiconductor device

Method for producing a semiconductor device using a solder alloy

Manufacturing method of semiconductor device

Semiconductor device and manufacturing method thereof

Power semiconductor module

Method of manufacturing semiconductor device

Semiconductor device and method of relaxing thermal stress

Power semiconductor module ceramic substrate with upper and lower p...

Insulation substrate for a semiconductor device

Zirconia-added alumina substrate with direct bonding of copper

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE UNIT AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE COOLER AND SEMICONDUCTOR MODULE

COOLING DEVICE FOR SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE

METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR MODULE COOLER AND SEMICONDUCTOR MODULE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND COOLER

SEMICONDUCTOR MODULE AND HEAT RADIATION MEMBER

SEMICONDUCTOR MODULE AND COOLING UNIT

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device

Power semiconductor module

Manufacturing method of semiconductor device

Method for producing a semiconductor device using a solder alloy

Solder alloy and a semiconductor device using the solder alloy

Semiconductor device and manufacturing method thereof

Semiconductor device and method for producing the same

Power semiconductor module

Semiconductor device and method of relaxing thermal stress

Power semiconductor module

Method of manufacturing semiconductor device

Power semiconductor module