Akira Nagai

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Terminal, server, method and program
- Patent number 12,021,974
- Issue date Jun 25, 2024
- Nippon Telegraph and Telephone Corporation
- Akira Nagai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Key exchange system, method and program for generating a shared key...
- Patent number 11,909,867
- Issue date Feb 20, 2024
- Nippon Telegraph and Telephone Corporation
- Junichi Tomida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Key exchange system, communication apparatus, key exchange method a...
- Patent number 11,902,428
- Issue date Feb 13, 2024
- Nippon Telegraph and Telephone Corporation
- Junichi Tomida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Shared key system, information processing apparatus, equipment, sha...
- Patent number 11,791,993
- Issue date Oct 17, 2023
- Nippon Telegraph and Telephone Corporation
- Akira Nagai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin member and sheet using same, and heat storage material and he...
- Patent number 11,535,782
- Issue date Dec 27, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Akira Nagai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Resin member and sheet using same, method for producing resin membe...
- Patent number 11,441,022
- Issue date Sep 13, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Akira Nagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, heat storage material, and commodity
- Patent number 11,352,466
- Issue date Jun 7, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Naoki Furukawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Authentication control system, server apparatus, client apparatus,...
- Patent number 10,979,411
- Issue date Apr 13, 2021
- Nippon Telegraph and Telephone Corporation
- Tetsutaro Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,734,350
- Issue date Aug 4, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Key exchange method, key exchange system, key device, terminal devi...
- Patent number 10,419,213
- Issue date Sep 17, 2019
- Nippon Telegraph and Telephone Corporation
- Akira Nagai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Optical semiconductor element mounting substrate and optical semico...
- Patent number 10,381,533
- Issue date Aug 13, 2019
- Hitachi Chemical Company, Ltd.
- Hayato Kotani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor adhesive, and semiconductor device and method for man...
- Patent number 10,224,311
- Issue date Mar 5, 2019
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brake pad for yaw control, and brake member
- Patent number 9,568,061
- Issue date Feb 14, 2017
- Hitachi Chemical Company, Ltd.
- Mika Kobune
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Thermosetting resin composition for sealing packing of semiconducto...
- Patent number 9,431,314
- Issue date Aug 30, 2016
- Hitachi Chemical Company, Ltd.
- Tetsuya Enomoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,425,120
- Issue date Aug 23, 2016
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition for light reflection, method for ma...
- Patent number 9,387,608
- Issue date Jul 12, 2016
- Hitachi Chemical Company, Ltd.
- Hayato Kotani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Welding transformer and welding transformer assembly and welding ap...
- Patent number 9,202,622
- Issue date Dec 1, 2015
- KOYO GIKEN INC.
- Koji Kai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, laminate sheet and printed wiring board...
- Patent number 8,420,210
- Issue date Apr 16, 2013
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,458
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,457
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,252,419
- Issue date Aug 28, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin molding material for sealing and electronic component d...
- Patent number 8,084,130
- Issue date Dec 27, 2011
- Hitachi Chemical Co., Ltd.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for connection of circuit member and semiconductor device...
- Patent number 8,044,524
- Issue date Oct 25, 2011
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Production method of semiconductor device and bonding film
- Patent number 8,034,659
- Issue date Oct 11, 2011
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 7,879,445
- Issue date Feb 1, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and multilayer substrate therefor
- Patent number 7,692,296
- Issue date Apr 6, 2010
- Hitachi Chemical Company, Ltd.
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber-reinforced composite material, method for manufacturing the s...
- Patent number 7,691,473
- Issue date Apr 6, 2010
- Rohm Co., Ltd.
- Hiroyuki Yano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
AUTHENTICATION-PERMISSION SYSTEM, EQUIPMENT, AUTHENTICATION-PERMISS...
- Publication number 20230396614
- Publication date Dec 7, 2023
- Nippon Telegraph and Telephone Corporation
- Yusuke IIJIMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TERMINAL, SERVER, METHOD AND PROGRAM
- Publication number 20220337403
- Publication date Oct 20, 2022
- Nippon Telegraph and Telephone Corporation
- Akira NAGAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
KEY EXCHANGE SYSTEM, COMMUNICATION APPARATUS, KEY EXCHANGE METHOD A...
- Publication number 20220303124
- Publication date Sep 22, 2022
- Nippon Telegraph and Telephone Corporation
- Junichi TOMIDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
KEY EXCHANGE SYSTEM, COMMUNICATION APPARATUS, KEY EXCHANGE METHOD A...
- Publication number 20220224520
- Publication date Jul 14, 2022
- Nippon Telegraph and Telephone Corporation
- Junichi TOMIDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
AUTHENTICATION-PERMISSION SYSTEM, INFORMATION PROCESSING APPARATUS,...
- Publication number 20210344515
- Publication date Nov 4, 2021
- Nippon Telegraph and Telephone Corporation
- Sakurako TAMURA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEA...
- Publication number 20210301059
- Publication date Sep 30, 2021
- Showa Denko Materials Co., Ltd.
- Naoki FURUKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
- Publication number 20210261706
- Publication date Aug 26, 2021
- Showa Denko Materials Co., Ltd.
- Naoki FURUKAWA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
- Publication number 20210246349
- Publication date Aug 12, 2021
- Showa Denko Materials Co., Ltd.
- Naoki FURUKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SHARED KEY SYSTEM, INFORMATION PROCESSING APPARATUS, EQUIPMENT, SHA...
- Publication number 20210211275
- Publication date Jul 8, 2021
- Nippon Telegraph and Telephone Corporation
- Akira NAGAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RESIN MEMBER, METHOD FOR PRODUCING RESIN MEMBER AND HEAT STORAGE BODY
- Publication number 20210024803
- Publication date Jan 28, 2021
- Keiko KIZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND COMMODITY
- Publication number 20200165437
- Publication date May 28, 2020
- Hitachi Chemical Company, Ltd.
- Naoki FURUKAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN MEMBER AND SHEET USING SAME, AND HEAT STORAGE MATERIAL AND HE...
- Publication number 20200048521
- Publication date Feb 13, 2020
- Hitachi Chemical Company, Ltd.
- Akira NAGAI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RESIN MEMBER AND SHEET USING SAME, METHOD FOR PRODUCING RESIN MEMBE...
- Publication number 20200048442
- Publication date Feb 13, 2020
- Hitachi Chemical Company, Ltd.
- Akira NAGAI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITE MEMBER AND PRODUCTION METHOD THEREFOR, HEAT STORAGE MATER...
- Publication number 20190241784
- Publication date Aug 8, 2019
- Hitachi Chemical Company, Ltd.
- Tsuyoshi MORIMOTO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190123014
- Publication date Apr 25, 2019
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTHENTICATION CONTROL SYSTEM, SERVER APPARATUS, CLIENT APPARATUS,...
- Publication number 20180359234
- Publication date Dec 13, 2018
- Nippon Telegraph and Telephone Corporation
- Tetsutaro KOBAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20180312731
- Publication date Nov 1, 2018
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
KEY EXCHANGE METHOD, KEY EXCHANGE SYSTEM, KEY DEVICE, TERMINAL DEVI...
- Publication number 20170373841
- Publication date Dec 28, 2017
- NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Akira NAGAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR ADHESIVE, AND SEMICONDUCTOR DEVICE AND METHOD FOR MAN...
- Publication number 20170345797
- Publication date Nov 30, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICO...
- Publication number 20170040513
- Publication date Feb 9, 2017
- Hitachi Chemical Company, Ltd.
- Hayato Kotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20150332983
- Publication date Nov 19, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRAKE PAD FOR YAW CONTROL, AND BRAKE MEMBER
- Publication number 20150308532
- Publication date Oct 29, 2015
- Mika KOBUNE
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...
- Publication number 20150048495
- Publication date Feb 19, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...
- Publication number 20150035175
- Publication date Feb 5, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20150014842
- Publication date Jan 15, 2015
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WELDING TRANSFORMER AND WELDING TRANSFORMER ASSEMBLY AND WELDING AP...
- Publication number 20140360994
- Publication date Dec 11, 2014
- KOYO GIKEN INC.
- Koji Kai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTO...
- Publication number 20120101191
- Publication date Apr 26, 2012
- Hitachi Chemical Company, Ltd.
- Tetsuya ENOMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247867
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247874
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Akira Nagai

Person

Patents Grantslast 30 patents

Terminal, server, method and program

Key exchange system, method and program for generating a shared key...

Key exchange system, communication apparatus, key exchange method a...

Shared key system, information processing apparatus, equipment, sha...

Adhesive for semiconductor device, and high productivity method for...

Resin member and sheet using same, and heat storage material and he...

Resin member and sheet using same, method for producing resin membe...

Resin composition, heat storage material, and commodity

Authentication control system, server apparatus, client apparatus,...

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device including heating and...

Key exchange method, key exchange system, key device, terminal devi...

Optical semiconductor element mounting substrate and optical semico...

Semiconductor adhesive, and semiconductor device and method for man...

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Brake pad for yaw control, and brake member

Thermosetting resin composition for sealing packing of semiconducto...

Semiconductor device and production method therefor

Thermosetting resin composition for light reflection, method for ma...

Welding transformer and welding transformer assembly and welding ap...

Resin composition, prepreg, laminate sheet and printed wiring board...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Epoxy resin molding material for sealing and electronic component d...

Adhesive for connection of circuit member and semiconductor device...

Production method of semiconductor device and bonding film

Adhesive for bonding circuit members, circuit board and process for...

Semiconductor device and multilayer substrate therefor

Fiber-reinforced composite material, method for manufacturing the s...

Patents Applicationslast 30 patents

AUTHENTICATION-PERMISSION SYSTEM, EQUIPMENT, AUTHENTICATION-PERMISS...

TERMINAL, SERVER, METHOD AND PROGRAM

KEY EXCHANGE SYSTEM, COMMUNICATION APPARATUS, KEY EXCHANGE METHOD A...

KEY EXCHANGE SYSTEM, COMMUNICATION APPARATUS, KEY EXCHANGE METHOD A...

AUTHENTICATION-PERMISSION SYSTEM, INFORMATION PROCESSING APPARATUS,...

ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEA...

RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE

RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE

SHARED KEY SYSTEM, INFORMATION PROCESSING APPARATUS, EQUIPMENT, SHA...

RESIN MEMBER, METHOD FOR PRODUCING RESIN MEMBER AND HEAT STORAGE BODY

RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND COMMODITY

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

RESIN MEMBER AND SHEET USING SAME, AND HEAT STORAGE MATERIAL AND HE...

RESIN MEMBER AND SHEET USING SAME, METHOD FOR PRODUCING RESIN MEMBE...

COMPOSITE MEMBER AND PRODUCTION METHOD THEREFOR, HEAT STORAGE MATER...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

AUTHENTICATION CONTROL SYSTEM, SERVER APPARATUS, CLIENT APPARATUS,...

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

KEY EXCHANGE METHOD, KEY EXCHANGE SYSTEM, KEY DEVICE, TERMINAL DEVI...

SEMICONDUCTOR ADHESIVE, AND SEMICONDUCTOR DEVICE AND METHOD FOR MAN...

OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICO...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

BRAKE PAD FOR YAW CONTROL, AND BRAKE MEMBER

ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...

ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

WELDING TRANSFORMER AND WELDING TRANSFORMER ASSEMBLY AND WELDING AP...

THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTO...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...