Akira Niitsuma

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic circuit device and method of manufacturing same
- Patent number 5,049,980
- Issue date Sep 17, 1991
- Kabushiki Kaisha Toshiba
- Tamio Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bump electrode and electronic circuit device
- Patent number 4,857,482
- Issue date Aug 15, 1989
- Kabushiki Kaisha Toshiba
- Masayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS