Akira Oga

Person

Kadoma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame, semiconductor device, method of manufacturing the lead...
- Patent number 8,039,932
- Issue date Oct 18, 2011
- Panasonic Corporation
- Akira Oga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame
- Patent number D600219
- Issue date Sep 15, 2009
- Panasonic Corporation
- Akira Oga
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
High heat release semiconductor and method for manufacturing the same
- Patent number 7,508,055
- Issue date Mar 24, 2009
- Panasonic Corporation
- Yutaka Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, resin-molded semiconductor device including the leadfram...
- Patent number 6,984,880
- Issue date Jan 10, 2006
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, resin-molded semiconductor device including the leadfram...
- Patent number 6,720,207
- Issue date Apr 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method for fabricating resin-encapsulated semiconduc...
- Patent number 6,645,792
- Issue date Nov 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method of manufacturing lead frame, semiconductor devic...
- Patent number 6,225,146
- Issue date May 1, 2001
- Matsushita Electronics Corporation
- Yukio Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method of manufacturing lead frame, semiconductor devic...
- Patent number 5,977,615
- Issue date Nov 2, 1999
- Matsushita Electronics Corporation
- Yukio Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing the same, and resin sealed s...
- Patent number 5,708,295
- Issue date Jan 13, 1998
- Matsushita Electronics Corporation
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120038033
- Publication date Feb 16, 2012
- PANASONIC CORPORATION
- Akira OGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20110151622
- Publication date Jun 23, 2011
- Panasonic Corporation
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE LEAD...
- Publication number 20090045492
- Publication date Feb 19, 2009
- Matsushita Electric Industrial Co., Ltd.
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20080246129
- Publication date Oct 9, 2008
- Matsushita Electric Industrial Co., Ltd.
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame and semiconductor device using the same
- Publication number 20070262409
- Publication date Nov 15, 2007
- Yoichiro Nozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, lead frame, and methods for manufacturing the...
- Publication number 20060049508
- Publication date Mar 9, 2006
- Matsushita Electric Industrial Co., Ltd.
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050253280
- Publication date Nov 17, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yutaka Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, resin-molded semiconductor device including the leadfram...
- Publication number 20040094829
- Publication date May 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame and method for fabricating resin-encapsulated semiconduc...
- Publication number 20030003628
- Publication date Jan 2, 2003
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, resin-molded semiconductor device including the leadfram...
- Publication number 20020109214
- Publication date Aug 15, 2002
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Lead frame, semiconductor device, method of manufacturing the lead...

Lead frame

High heat release semiconductor and method for manufacturing the same

Leadframe, resin-molded semiconductor device including the leadfram...

Leadframe, resin-molded semiconductor device including the leadfram...

Lead frame and method for fabricating resin-encapsulated semiconduc...

Lead frame, method of manufacturing lead frame, semiconductor devic...

Lead frame, method of manufacturing lead frame, semiconductor devic...

Lead frame and method of manufacturing the same, and resin sealed s...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Method of manufacturing semiconductor device

LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE LEAD...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Lead frame and semiconductor device using the same

Semiconductor device, lead frame, and methods for manufacturing the...

Semiconductor device and method for fabricating the same

Leadframe, resin-molded semiconductor device including the leadfram...

Lead frame and method for fabricating resin-encapsulated semiconduc...

Leadframe, resin-molded semiconductor device including the leadfram...