Akira Ohtsuka

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for semiconductor apparatus
- Patent number 5,708,959
- Issue date Jan 13, 1998
- Sumitomo Electric Industries, Ltd.
- Mituo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for semiconductor apparatus
- Patent number 5,563,101
- Issue date Oct 8, 1996
- Sumitomo Electric Industries, Ltd.
- Mituo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for semiconductor apparatus
- Patent number 5,525,428
- Issue date Jun 11, 1996
- Sumitomo Electric Industries, Ltd.
- Mituo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for semiconductor apparatus
- Patent number 5,409,864
- Issue date Apr 25, 1995
- Sumitomo Electric Industries, Ltd.
- Mituo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device package having improved sealing at the aluminu...
- Patent number 5,159,432
- Issue date Oct 27, 1992
- Sumitomo Electric Industries, Ltd.
- Soichiro Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor apparatus having a composite material
- Patent number 5,086,333
- Issue date Feb 4, 1992
- Sumitomo Electric Industries, Ltd.
- Mituo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated circuit package
- Patent number 4,879,588
- Issue date Nov 7, 1989
- Sumitomo Electric Industries, Ltd.
- Akira Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for use in semiconductor apparatus
- Patent number 4,480,013
- Issue date Oct 30, 1984
- Sumitomo Electric Industries, Ltd.
- Yoshihiko Doi
- H01 - BASIC ELECTRIC ELEMENTS

Akira Ohtsuka

Person

Patents Grantslast 30 patents

Substrate for semiconductor apparatus

Substrate for semiconductor apparatus

Substrate for semiconductor apparatus

Substrate for semiconductor apparatus

Semiconductor device package having improved sealing at the aluminu...

Substrate for semiconductor apparatus having a composite material

Integrated circuit package

Substrate for use in semiconductor apparatus