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Akira Ohuchi
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
7,902,678
Issue date
Mar 8, 2011
NEC Corporation
Akira Ohuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Packaging method and packaging structures of semiconductor devices
Patent number
6,590,287
Issue date
Jul 8, 2003
NEC Corporation
Akira Ohuchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Manufacturing Method Thereof
Publication number
20080251942
Publication date
Oct 16, 2008
Akira Ohuchi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Packaging method and packaging structures of semiconductor devices
Publication number
20020033525
Publication date
Mar 21, 2002
NEC Corporation
Akira Ohuchi
H01 - BASIC ELECTRIC ELEMENTS