Akira Oikawa

Person

Kirishima-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 11,973,486
- Issue date Apr 30, 2024
- Kyocera Corporation
- Sinichiro Kitanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave device and acoustic wave module
- Patent number 10,193,528
- Issue date Jan 29, 2019
- Kyocera Corporation
- Akira Oikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component
- Patent number 9,773,964
- Issue date Sep 26, 2017
- Kyocera Corporation
- Akira Oikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device
- Patent number 9,386,703
- Issue date Jul 5, 2016
- Kyocera Corporation
- Akira Oikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing surface acoustic wave device
- Patent number 7,513,022
- Issue date Apr 7, 2009
- Kyocera Corporation
- Mitsutaka Shimada
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor device with surface acoustic wave elements
- Patent number 7,353,710
- Issue date Apr 8, 2008
- Kyocera Corporation
- Akira Oikawa
- G01 - MEASURING TESTING
Information Patent Grant
Surface acoustic wave device and method for manufacturing same
- Patent number 7,154,206
- Issue date Dec 26, 2006
- Kyocera Corporation
- Mitsutaka Shimada
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20230143137
- Publication date May 11, 2023
- KYOCERA CORPORATION
- Akira OIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220190805
- Publication date Jun 16, 2022
- KYOCERA CORPORATION
- Akira OIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220123713
- Publication date Apr 21, 2022
- KYOCERA CORPORATION
- Sinichiro KITANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE DEVICE AND ACUOUSTIC WAVE MODULE
- Publication number 20160248399
- Publication date Aug 25, 2016
- Kyocera Corporation
- Akira OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140369013
- Publication date Dec 18, 2014
- KYOCERA CORPORATION
- Akira Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20140361663
- Publication date Dec 11, 2014
- KYOCERA CORPORATION
- Akira Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure sensor device
- Publication number 20070107522
- Publication date May 17, 2007
- Akira Oikawa
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing surface acoustic wave device
- Publication number 20060220500
- Publication date Oct 5, 2006
- KYOCERA CORPORATION
- Mitsutaka Shimada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Surface acoustic wave device and method for manufacturing same
- Publication number 20040113215
- Publication date Jun 17, 2004
- KYOCERA CORPORATION
- Mitsutaka Shimada
- H03 - BASIC ELECTRONIC CIRCUITRY

Akira Oikawa

Person

Patents Grantslast 30 patents

Electronic component and method for manufacturing the same

Acoustic wave device and acoustic wave module

Electronic component

Electronic device

Method for manufacturing surface acoustic wave device

Pressure sensor device with surface acoustic wave elements

Surface acoustic wave device and method for manufacturing same

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

ACOUSTIC WAVE DEVICE AND ACUOUSTIC WAVE MODULE

ELECTRONIC DEVICE

ELECTRONIC COMPONENT

Pressure sensor device

Method for manufacturing surface acoustic wave device

Surface acoustic wave device and method for manufacturing same