Membership
Tour
Register
Log in
Akira Owatari
Follow
Person
Tokyo, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Electroless plating apparatus and electroless plating method
Patent number
7,878,144
Issue date
Feb 1, 2011
Ebara Corporation
Akira Owatari
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate processing apparatus and substrate processing method
Patent number
7,575,636
Issue date
Aug 18, 2009
Ebara Corporation
Seiji Katsuoka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method and apparatus for forming metal film
Patent number
7,498,261
Issue date
Mar 3, 2009
Ebara Corporation
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate processing apparatus and substrate processing method
Patent number
7,442,257
Issue date
Oct 28, 2008
Ebara Corporation
Seiji Katsuoka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for processing substrate
Patent number
7,285,492
Issue date
Oct 23, 2007
Ebara Corporation
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate processing apparatus and substrate processing method
Patent number
7,087,117
Issue date
Aug 8, 2006
Ebara Corporation
Seiji Katsuoka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate processing apparatus
Patent number
6,824,613
Issue date
Nov 30, 2004
Ebara Corporation
Naoki Dai
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING APPARATUS
Publication number
20220228285
Publication date
Jul 21, 2022
EBARA CORPORATION
Hiroyuki Kanda
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
Publication number
20100105154
Publication date
Apr 29, 2010
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND PRO...
Publication number
20100075498
Publication date
Mar 25, 2010
Daisuke Takagi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Apparatus and method for forming magnetic film
Publication number
20080176008
Publication date
Jul 24, 2008
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Substrate Processing Method and Substrate Processing Apparatus
Publication number
20080138508
Publication date
Jun 12, 2008
Daisuke Takagi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Semiconductor Device and Method for Manufacturing the Same, and Pro...
Publication number
20080067679
Publication date
Mar 20, 2008
Daisuke Takagi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method and apparatus for processing substrate
Publication number
20080000776
Publication date
Jan 3, 2008
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Substrate processing method and substrate processing apparatus
Publication number
20070224811
Publication date
Sep 27, 2007
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Electroless plating apparatus and electroless plating method
Publication number
20070092658
Publication date
Apr 26, 2007
Akira Owatari
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Substrate processing apparatus and substrate processing method
Publication number
20060243205
Publication date
Nov 2, 2006
Seiji Katsuoka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Substrate processing apparatus and substrate processing method
Publication number
20060243204
Publication date
Nov 2, 2006
Seiji Katsuoka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Substrate processing apparatus and substrate processing method
Publication number
20060236929
Publication date
Oct 26, 2006
Seiji Katsuoka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method and apparatus for forming metal film
Publication number
20060057839
Publication date
Mar 16, 2006
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method and apparatus for processing substrate
Publication number
20050245080
Publication date
Nov 3, 2005
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Wet processing method and processing apparatus of substrate
Publication number
20050208774
Publication date
Sep 22, 2005
Akira Fukunaga
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Substrate processing apparatus and substrate processing method
Publication number
20050072358
Publication date
Apr 7, 2005
Seiji Katsuoka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Substrate processing method and substrate processing apparatus
Publication number
20050022909
Publication date
Feb 3, 2005
Xinming Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Substrate processing apparatus
Publication number
20030221612
Publication date
Dec 4, 2003
Naoki Dai
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...