Akira Shimase

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer conveyance unit and wafer conveyance method
- Patent number 12,347,718
- Issue date Jul 1, 2025
- Hamamatsu Photonics K.K.
- Akira Shimase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor inspecting method and semiconductor inspecting device
- Patent number 12,340,504
- Issue date Jun 24, 2025
- Hamamatsu Photonics K.K.
- Akira Shimase
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device inspection method and semiconductor device ins...
- Patent number 12,222,387
- Issue date Feb 11, 2025
- Hamamatsu Photonics K.K.
- Norimichi Chinone
- G01 - MEASURING TESTING
Information Patent Grant
Analysis method, analysis device, analysis program, and recording m...
- Patent number 11,579,184
- Issue date Feb 14, 2023
- Hamamatsu Photonics K.K.
- Akira Shimase
- G01 - MEASURING TESTING
Information Patent Grant
Optical measurement method, optical measurement device, optical mea...
- Patent number 11,181,361
- Issue date Nov 23, 2021
- Hamamatsu Photonics K.K.
- Akira Shimase
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device inspection apparatus and semiconductor device...
- Patent number 10,955,458
- Issue date Mar 23, 2021
- Hamamatsu Photonics K.K.
- Toru Matsumoto
- G01 - MEASURING TESTING
Information Patent Grant
Inspection method, inspection device, and marking forming method
- Patent number 10,923,404
- Issue date Feb 16, 2021
- Hamamatsu Photonics K.K.
- Shinsuke Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method, inspection device, and marking forming method
- Patent number 10,586,743
- Issue date Mar 10, 2020
- Hamamatsu Photonics K.K.
- Shinsuke Suzuki
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor failure analysis apparatus which acquires a failure o...
- Patent number 7,865,012
- Issue date Jan 4, 2011
- Hamamatsu Photonics K.K.
- Toshiyuki Majima
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor failure analysis apparatus, failure analysis method,...
- Patent number 7,805,691
- Issue date Sep 28, 2010
- Hamamatsu Photonics K.K.
- Toshiyuki Majima
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
AUTOFOCUS ASSISTANCE METHOD, AUTOFOCUS ASSISTANCE DEVICE, AND AUTOF...
- Publication number 20240402092
- Publication date Dec 5, 2024
- Hamamatsu Photonics K.K.
- Akira SHIMASE
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR INSPECTING METHOD AND SEMICONDUCTOR INSPECTING DEVICE
- Publication number 20230206422
- Publication date Jun 29, 2023
- Hamamatsu Photonics K.K.
- Akira SHIMASE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INSPECTION METHOD AND SEMICONDUCTOR DEVICE INS...
- Publication number 20230184827
- Publication date Jun 15, 2023
- Hamamatsu Photonics K.K.
- Norimichi CHINONE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE INSPECTION METHOD AND SEMICONDUCTOR DEVICE INS...
- Publication number 20230184825
- Publication date Jun 15, 2023
- Hamamatsu Photonics K.K.
- Norimichi CHINONE
- G01 - MEASURING TESTING
Information Patent Application
WAFER CONVEYANCE UNIT AND WAFER CONVEYANCE METHOD
- Publication number 20220406644
- Publication date Dec 22, 2022
- Hamamatsu Photonics K.K.
- Akira SHIMASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALYSIS METHOD, ANALYSIS DEVICE, ANALYSIS PROGRAM, AND RECORDING M...
- Publication number 20210373071
- Publication date Dec 2, 2021
- Hamamatsu Photonics K.K.
- Akira SHIMASE
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL MEASUREMENT METHOD, OPTICAL MEASUREMENT DEVICE, OPTICAL MEA...
- Publication number 20200333134
- Publication date Oct 22, 2020
- Hamamatsu Photonics K.K.
- Akira SHIMASE
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION METHOD, INSPECTION DEVICE, AND MARKING FORMING METHOD
- Publication number 20200152525
- Publication date May 14, 2020
- HAMAMATSU PHOTONICS K. K.
- Shinsuke SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION METHOD, INSPECTION DEVICE, AND MARKING FORMING METHOD
- Publication number 20190371682
- Publication date Dec 5, 2019
- Hamamatsu Photonics K.K.
- Shinsuke SUZUKI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND SEMICONDUCTOR DEVICE...
- Publication number 20190271734
- Publication date Sep 5, 2019
- Hamamatsu Photonics K.K.
- Toru MATSUMOTO
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor failure analysis apparatus, failure analysis method,...
- Publication number 20070294053
- Publication date Dec 20, 2007
- Hamamatsu Photonics K.K.
- Toshiyuki Majima
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor failure analysis apparatus, failure analysis method,...
- Publication number 20070292018
- Publication date Dec 20, 2007
- Hamamatsu Photonics K.K.
- Toshiyuki Majima
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor failure analysis apparatus, failure analysis method,...
- Publication number 20070290696
- Publication date Dec 20, 2007
- Hamamatsu Photonics K.K.
- Toshiyuki Majima
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor failure analysis apparatus, failure analysis method,...
- Publication number 20070020781
- Publication date Jan 25, 2007
- Hamamatsu Photonics K.K.
- Toshiyuki Majima
- G06 - COMPUTING CALCULATING COUNTING

Akira Shimase

Person

Patents Grantslast 30 patents

Wafer conveyance unit and wafer conveyance method

Semiconductor inspecting method and semiconductor inspecting device

Semiconductor device inspection method and semiconductor device ins...

Analysis method, analysis device, analysis program, and recording m...

Optical measurement method, optical measurement device, optical mea...

Semiconductor device inspection apparatus and semiconductor device...

Inspection method, inspection device, and marking forming method

Inspection method, inspection device, and marking forming method

Semiconductor failure analysis apparatus which acquires a failure o...

Semiconductor failure analysis apparatus, failure analysis method,...

Patents Applicationslast 30 patents

AUTOFOCUS ASSISTANCE METHOD, AUTOFOCUS ASSISTANCE DEVICE, AND AUTOF...

SEMICONDUCTOR INSPECTING METHOD AND SEMICONDUCTOR INSPECTING DEVICE

SEMICONDUCTOR DEVICE INSPECTION METHOD AND SEMICONDUCTOR DEVICE INS...

SEMICONDUCTOR DEVICE INSPECTION METHOD AND SEMICONDUCTOR DEVICE INS...

WAFER CONVEYANCE UNIT AND WAFER CONVEYANCE METHOD

ANALYSIS METHOD, ANALYSIS DEVICE, ANALYSIS PROGRAM, AND RECORDING M...

OPTICAL MEASUREMENT METHOD, OPTICAL MEASUREMENT DEVICE, OPTICAL MEA...

INSPECTION METHOD, INSPECTION DEVICE, AND MARKING FORMING METHOD

INSPECTION METHOD, INSPECTION DEVICE, AND MARKING FORMING METHOD

SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND SEMICONDUCTOR DEVICE...

Semiconductor failure analysis apparatus, failure analysis method,...

Semiconductor failure analysis apparatus, failure analysis method,...

Semiconductor failure analysis apparatus, failure analysis method,...

Semiconductor failure analysis apparatus, failure analysis method,...