Membership
Tour
Register
Log in
Akira Sugai
Follow
Person
Miyazaki, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Mold resin sealing device and molding method
Patent number
8,236,621
Issue date
Aug 7, 2012
Lapis Semiconductor Co., Ltd.
Akira Sugai
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Transfer molding apparatus and method for manufacturing semiconduct...
Patent number
7,625,768
Issue date
Dec 1, 2009
Oki Semiconductor Co., Ltd.
Hiroyuki Nishi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Transfer molding apparatus and method for manufacturing semiconduct...
Patent number
7,253,021
Issue date
Aug 7, 2007
Oki Electric Industry Co., Ltd.
Hiroyuki Nishi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
6,995,038
Issue date
Feb 7, 2006
Oki Electric Industry Co., Ltd.
Yoshimi Egawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer molding method for manufacturing semiconductor devices
Patent number
6,767,484
Issue date
Jul 27, 2004
Oki Electric Industry Co., Ltd.
Hiroyuki Nishi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Molding die set and semiconductor device fabricated using the same
Patent number
6,756,690
Issue date
Jun 29, 2004
Oki Electric Industry Co., Ltd.
Shin Kurosawa
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Molding die set
Patent number
6,491,508
Issue date
Dec 10, 2002
Oki Electric Industry Co., Ltd.
Shin Kurosawa
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Transfer molding apparatus for manufacturing semiconductor devices
Patent number
6,267,577
Issue date
Jul 31, 2001
Oki Electric Industry Co., Ltd.
Hiroyuki Nishi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Mold resin sealing device and molding method
Publication number
20110171786
Publication date
Jul 14, 2011
Oki Semiconductor Co., Ltd.
Akira Sugai
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
TRANSFER MOLDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCT...
Publication number
20070292975
Publication date
Dec 20, 2007
Oki Electric Industry Co., Ltd.
Hiroyuki Nishi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Method of manufacturing semiconductor device
Publication number
20050026418
Publication date
Feb 3, 2005
Yoshimi Egawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transfer molding apparatus and method for manufacturing semiconduct...
Publication number
20040248328
Publication date
Dec 9, 2004
Hiroyuki Nishi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Molding die set and semiconductor device fabricated using the same
Publication number
20030042625
Publication date
Mar 6, 2003
Shin Kurosawa
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Transfer molding apparatus and method for manufacturing semiconduct...
Publication number
20010035590
Publication date
Nov 1, 2001
Hiroyuki Nishi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL