Akira Tai

Person

Okazaki-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having semiconductor chip and metal plate
- Patent number 8,441,122
- Issue date May 14, 2013
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of patterning resin insulation laye...
- Patent number 8,405,218
- Issue date Mar 26, 2013
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of metallic electrode of semiconductor device and...
- Patent number 8,263,490
- Issue date Sep 11, 2012
- Denso Corporation
- Manabu Tomisaka
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having first and second insulation separation...
- Patent number 7,906,829
- Issue date Mar 15, 2011
- Denso Corporation
- Akira Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile semiconductor memory device and method of erasing and p...
- Patent number 7,796,442
- Issue date Sep 14, 2010
- Denso Corporation
- Mitsutaka Katada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having SOI construction
- Patent number 7,105,910
- Issue date Sep 12, 2006
- Denso Corporation
- Seiichiro Ishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile semiconductor storage device having conductive layer s...
- Patent number 6,818,942
- Issue date Nov 16, 2004
- Denso Corporation
- Akira Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110207264
- Publication date Aug 25, 2011
- DENSO CORPORATION
- Manabu TOMISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation method of metallic electrode of semiconductor device and...
- Publication number 20110207241
- Publication date Aug 25, 2011
- DENSO CORPORATION
- Manabu Tomisaka
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAY...
- Publication number 20110198733
- Publication date Aug 18, 2011
- DENSO CORPORATION
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having semiconductor chip and metal plate and...
- Publication number 20110042741
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nonvolatile semiconductor memory device and method of erasing and p...
- Publication number 20080239817
- Publication date Oct 2, 2008
- DENSO CORPORATION
- Mitsutaka Katada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having first and second insulation separation...
- Publication number 20060278950
- Publication date Dec 14, 2006
- DENSO CORPORATION
- Akira Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Easily crack checkable semiconductor device
- Publication number 20060071284
- Publication date Apr 6, 2006
- DENSO CORPORATION
- Akira Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bipolar transistor having multiple interceptors
- Publication number 20050189617
- Publication date Sep 1, 2005
- DENSO Corporation
- Shoji Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having SOI construction
- Publication number 20050110116
- Publication date May 26, 2005
- DENSO Corporation
- Seiichiro Ishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-volatile semiconductor storage device having conductive layer s...
- Publication number 20030136987
- Publication date Jul 24, 2003
- Akira Tai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device having semiconductor chip and metal plate

Semiconductor device and method of patterning resin insulation laye...

Formation method of metallic electrode of semiconductor device and...

Semiconductor device having first and second insulation separation...

Nonvolatile semiconductor memory device and method of erasing and p...

Semiconductor device having SOI construction

Non-volatile semiconductor storage device having conductive layer s...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Formation method of metallic electrode of semiconductor device and...

SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAY...

Semiconductor device having semiconductor chip and metal plate and...

Nonvolatile semiconductor memory device and method of erasing and p...

Semiconductor device having first and second insulation separation...

Easily crack checkable semiconductor device

Bipolar transistor having multiple interceptors

Semiconductor device having SOI construction

Non-volatile semiconductor storage device having conductive layer s...