Akira Takakura

Person

Nagoya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Curable resin composition and electrical component using the same
- Patent number 11,795,325
- Issue date Oct 24, 2023
- Denso Corporation
- Akira Takakura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin additive, polyphenylene sulfide resin composition, and electr...
- Patent number 9,290,638
- Issue date Mar 22, 2016
- DENSO CORPORATION
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hardening resin composition, sealing material, and electronic devic...
- Patent number 9,082,709
- Issue date Jul 14, 2015
- Denso Corporation
- Hiroyuki Okuhira
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THE SAME
- Publication number 20210002413
- Publication date Jan 7, 2021
- DENSO CORPORATION
- Hiroyuki OKUHIRA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THE SAME
- Publication number 20200362166
- Publication date Nov 19, 2020
- DENSO CORPORATION
- Akira TAKAKURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION AND ELETRICAL COMPONENT USING THE SAME
- Publication number 20200291170
- Publication date Sep 17, 2020
- DENSO CORPORATION
- Hiroyuki OKUHIRA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRICAL COMPONENT
- Publication number 20160001528
- Publication date Jan 7, 2016
- DENSO CORPORATION
- Akira TAKAKURA
- B32 - LAYERED PRODUCTS
Information Patent Application
CURABLE RESIN, SEALING MEMBER, AND ELECTRONIC DEVICE PRODUCT USING...
- Publication number 20150166728
- Publication date Jun 18, 2015
- DENSO CORPORATION
- Hiroyuki OKUHIRA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HARDENING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC DEVIC...
- Publication number 20140264959
- Publication date Sep 18, 2014
- DENSO CORPORATION
- Hiroyuki Okuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTR...
- Publication number 20140262414
- Publication date Sep 18, 2014
- DENSO CORPORATION
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD OF BONDING STRUCTURE
- Publication number 20140150973
- Publication date Jun 5, 2014
- DENSO CORPORATION
- Hiroyuki Okuhira
- B32 - LAYERED PRODUCTS

Akira Takakura

Person

Patents Grantslast 30 patents

Curable resin composition and electrical component using the same

Resin additive, polyphenylene sulfide resin composition, and electr...

Hardening resin composition, sealing material, and electronic devic...

Patents Applicationslast 30 patents

CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THE SAME

CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THE SAME

CURABLE RESIN COMPOSITION AND ELETRICAL COMPONENT USING THE SAME

ELECTRICAL COMPONENT

CURABLE RESIN, SEALING MEMBER, AND ELECTRONIC DEVICE PRODUCT USING...

HARDENING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC DEVIC...

RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTR...

EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD OF BONDING STRUCTURE