Akira Tanahashi

Person

Okazaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder preform and a process for its manufacture
- Patent number 10,081,852
- Issue date Sep 25, 2018
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform and a process for its manufacture
- Patent number 7,793,820
- Issue date Sep 14, 2010
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device having solder layer
- Patent number 7,601,625
- Issue date Oct 13, 2009
- Denso Corporation
- Chikage Noritake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tin-based solder layer and method for m...
- Patent number 7,579,212
- Issue date Aug 25, 2009
- Denso Corporation
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tin-based solder layer and method for m...
- Patent number 7,361,996
- Issue date Apr 22, 2008
- Denso Corporation
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering paste, soldering method, and surface-mounted type electro...
- Patent number 6,488,781
- Issue date Dec 3, 2002
- Denso Corporation
- Akira Tanahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method using soldering flux and soldering paste
- Patent number 6,142,363
- Issue date Nov 7, 2000
- Nippondenso Co., Ltd.
- Akira Tanahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering flux, soldering paste and soldering method using the same
- Patent number 5,919,317
- Issue date Jul 6, 1999
- Nippondenso Co., Ltd.
- Akira Tanahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Solder preform and a process for its manufacture
- Publication number 20110068149
- Publication date Mar 24, 2011
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder preform and a process for its manufacture
- Publication number 20080237301
- Publication date Oct 2, 2008
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having tin-based solder layer and method for m...
- Publication number 20070176293
- Publication date Aug 2, 2007
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having tin-based solder layer and method for m...
- Publication number 20060049521
- Publication date Mar 9, 2006
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device having solder layer
- Publication number 20050233568
- Publication date Oct 20, 2005
- Chikage Noritake
- H01 - BASIC ELECTRIC ELEMENTS

Akira Tanahashi

Person

Patents Grantslast 30 patents

Solder preform and a process for its manufacture

Solder preform and a process for its manufacture

Method for manufacturing semiconductor device having solder layer

Semiconductor device having tin-based solder layer and method for m...

Semiconductor device having tin-based solder layer and method for m...

Soldering paste, soldering method, and surface-mounted type electro...

Soldering method using soldering flux and soldering paste

Soldering flux, soldering paste and soldering method using the same

Patents Applicationslast 30 patents

Solder preform and a process for its manufacture

Solder preform and a process for its manufacture

Semiconductor device having tin-based solder layer and method for m...

Semiconductor device having tin-based solder layer and method for m...

Method for manufacturing semiconductor device having solder layer