Akira Tojo

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Battery
- Patent number 12,230,841
- Issue date Feb 18, 2025
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 11,610,860
- Issue date Mar 21, 2023
- Kabushiki Kaisha Toshiba
- Masatoshi Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,811,391
- Issue date Oct 20, 2020
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a three-sided textured substrate
- Patent number 10,573,603
- Issue date Feb 25, 2020
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 10,510,726
- Issue date Dec 17, 2019
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,438,935
- Issue date Oct 8, 2019
- TOSHIBA MEMORY CORPORATION
- Kazuo Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,975,732
- Issue date Mar 10, 2015
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wiring of a semiconductor device
- Patent number 8,859,415
- Issue date Oct 14, 2014
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor device
- Patent number 8,378,479
- Issue date Feb 19, 2013
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus
- Patent number 8,334,173
- Issue date Dec 18, 2012
- Kabushiki Kaisha Toshiba
- Takao Nogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 8,193,643
- Issue date Jun 5, 2012
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor device
- Patent number 8,008,773
- Issue date Aug 30, 2011
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BATTERY
- Publication number 20220271399
- Publication date Aug 25, 2022
- Kabushiki Kaisha Toshiba
- Akira TOJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20210091038
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Masatoshi Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190287945
- Publication date Sep 19, 2019
- KABUSHIKI KAISHA TOSHIBA
- Akira TOJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190287952
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Kazuo SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20190067250
- Publication date Feb 28, 2019
- KABUSHIKI KAISHA TOSHIBA
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180286819
- Publication date Oct 4, 2018
- KABUSHIKI KAISHA TOSHIBA
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130241040
- Publication date Sep 19, 2013
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20130078766
- Publication date Mar 28, 2013
- Takao NOGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING WIRING OF A SEMICONDUCTOR DEVICE
- Publication number 20120231625
- Publication date Sep 13, 2012
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20110272817
- Publication date Nov 10, 2011
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME
- Publication number 20110186982
- Publication date Aug 4, 2011
- Kabushiki Kaisha Toshiba
- Tomoyuki KITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20100233856
- Publication date Sep 16, 2010
- Kabushiki Kaisha Toshiba
- Takao NOGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20100052142
- Publication date Mar 4, 2010
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100052185
- Publication date Mar 4, 2010
- Kabushiki Kaisha Toshiba
- Akira TOJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING...
- Publication number 20090209065
- Publication date Aug 20, 2009
- Hideo NISHIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080217754
- Publication date Sep 11, 2008
- Kabushiki Kaisha Toshiba
- Akira TOJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20080179751
- Publication date Jul 31, 2008
- Kabushiki Kaisha Toshiba
- Tomoyuki Kitani
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Battery

Wire bonding apparatus and wire bonding method

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device having a three-sided textured substrate

Semiconductor device, method for manufacturing semiconductor device...

Semiconductor device

Semiconductor device and method of manufacturing the same

Method of forming wiring of a semiconductor device

Semiconductor device and method for fabricating semiconductor device

Method for manufacturing semiconductor apparatus

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating semiconductor device

Patents Applicationslast 30 patents

BATTERY

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

METHOD OF FORMING WIRING OF A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...