TREA

Akira Tomizawa

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  • Yokohama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electroless gold plating solution, method of plating with gold by u...
    • Patent number 5,202,151
    • Issue date Apr 13, 1993
    • Hitachi, Ltd.
    • Jiro Ushio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electronic device plated with gold by means of an electroless gold...
    • Patent number 4,963,974
    • Issue date Oct 16, 1990
    • Hitachi, Ltd.
    • Jiro Ushio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless gold plating solution
    • Patent number 4,880,464
    • Issue date Nov 14, 1989
    • Hitachi, Ltd.
    • Jiro Ushio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless gold plating solution
    • Patent number 4,804,559
    • Issue date Feb 14, 1989
    • Hitachi, Ltd.
    • Jiro Ushio
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless copper plating solution
    • Patent number 4,563,217
    • Issue date Jan 7, 1986
    • Hitachi, Ltd.
    • Hiroshi Kikuchi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Epoxy resin composition
    • Patent number 4,555,532
    • Issue date Nov 26, 1985
    • Hitachi, Ltd.
    • Isamu Tanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Epoxy resin composition
    • Patent number 4,460,718
    • Issue date Jul 17, 1984
    • Hitachi, Ltd.
    • Isamu Tanaka
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...