Akira Urakami

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Okayama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Dielectric film for printed wiring board, multilayer printed board,...
- Patent number 6,849,934
- Issue date Feb 1, 2005
- Japan Gore-Tex, Inc.
- Makoto Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with a coverlay film
- Patent number 5,473,118
- Issue date Dec 5, 1995
- Japan Gore-Tex, Inc.
- Sunao Fukutake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed semiconductor device containing porous fluorocarbon resin
- Patent number 5,446,315
- Issue date Aug 29, 1995
- Japan Gore-Tex, Inc.
- Yoshito Hazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device containing porous fluorocarbon resin
- Patent number 5,281,853
- Issue date Jan 25, 1994
- Japan Gore-Tex, Inc.
- Yoshito Hazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dielectric film for printed wiring board, multilayer printed board,...
- Publication number 20030219588
- Publication date Nov 27, 2003
- Makoto Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prepreg, and laminate and printed wiring board featuring same
- Publication number 20020132104
- Publication date Sep 19, 2002
- Akira Urakami
- B32 - LAYERED PRODUCTS